ATS-06B-30-C2-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.756" (70.00mm)
Width:	2.756" (70.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	5.31°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Heat sinks are devices primarily used to dissipate heat from an electronic device and are an essential part of electronics as thermal management is a critical component of performance and product reliability. The ATS-06B-30-C2-R0 is one type of heat sink that is perfect for cooling microprocessors and other miniaturized components. This article will explore the applications and working principle of the ATS-06B-30-C2-R0.

Application

The ATS-06B-30-C2-R0 is a heatsink designed specifically for thermal management of small components, as it is only 6mm thick and 30mm long. This type of heat sink is mainly used to cool down CPUs, GPUs, and other small components on PCBs. As it is designed specifically for miniaturized components, it does not require an additional mounting system. By adhering directly to the component with thermal paste or adhesive tape, the ATS-06B-30-C2-R0 can easily provide reliable thermal management.

Advantages

The ATS-06B-30-C2-R0 stands out from other heatsinks on the market due to its ultra-thin design. It is manufactured using high-quality aluminum which provides outstanding heat dissipation and durability. The heatsink is fanless meaning it is extremely quiet and it comes with an integrated heat spreader for improved thermal stability and protection from water. It is also capable of dissipating heat from the component quickly and efficiently allowing for higher performance. This makes the ATS-06B-30-C2-R0 an ideal heat sink for miniaturized components.

Working Principle

Heatsinks, such as the ATS-06B-30-C2-R0, are designed to efficiently dissipate heat from a component by increasing the surface area which the component is in contact with. This heatsink is designed to be thin and light, but still be able to heat dissipation levels over $2 \text{W/cm}^2$ which is far more efficient than thicker and bulkier heatsinks. The ATS-06B-30-C2-R0 works by gathering heat from the component using a layer of thermal paste or adhesive tape and transferring it to the heatsink via conduction. In this case, the heatsink is made of high-grade aluminum which dissipates heat quickly and dissipates it into the surrounding air. As the aluminum material is also lightweight and thin, it is able to dissipate more heat faster which keeps components at lower, reliable operating temperatures.

Conclusion

The ATS-06B-30-C2-R0 is an excellent heat sink for cooling down miniaturized components such as CPUs and GPUs. Its thin profile makes it ideal for cramped spaces while its aluminum construction provides excellent heat dissipation and durability. The fanless design also ensures that it is quiet and its integrated heat spreader allows for efficient thermal stability. All these features make the ATS-06B-30-C2-R0 a great choice for any thermal management needs.

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