ATS-06B-38-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	1.450" (36.83mm)
Width:	2.267" (57.60mm)
Diameter:	--
Height Off Base (Height of Fin):	0.900" (22.86mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	6.50°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

Heat sinks are extremely important for the safe and efficient operation of a wide range of applications. As a vital component of thermal management, the ATS-06B-38-C3-R0 heat sink is no exception to the rule. This heat sink helps with the cooling of a device by transfer of heat to the surrounding air. This article will discuss the application fields and working principles of the ATS-06B-38-C3-R0 heat sink.

Application Fields

ATS-06B-38-C3-R0 heat sinks are typically used in most electronic and automotive applications. They can improve the performance and reliability of processors, switches, transistors, sensors, LEDs, and other devices. With efficient heat dissipation, they protect these components from thermal damage or malfunction and extend their service life. In addition, ATS-06B-38-C3-R0 heat sinks are widely used in HVAC systems. They are perfect for chilling heat exchangers and radiators, making them more efficient and reliable. Some of the industries where heat sinks are installed include medical, telecommunications, automotive, aerospace, and industrial.

Working Principle

Heat sinks are designed to disperse the heat generated by a device into the surrounding atmosphere. The ATS-06B-38-C3-R0 heat sink is composed of a base and fins. The base is usually made of aluminum or copper alloy and acts as a heat transfer medium to the fins or other dissipation surfaces. The fins are what helps to dissipate the heat. The construction of these fins is engineered to provide the most efficient heat transfer to air. This is accomplished through high thermal conductivity and a maximum convection surface area that optimizes low-cost, natural convection air currents. Therefore, the larger the surface area of the heat sink, the more efficient it will be in dissipating heat. The ATS-06B-38-C3-R0 heat sink also includes a thermal interface material or TIM. This material acts as a bridge between the fins of the heat sink and the device it is cooling. TIM is designed to fill the gaps between components, filling in the imperfections to increase the efficiency of heat dissipation.

Conclusion

The ATS-06B-38-C3-R0 heat sink is a vital component in thermal management applications. Engineered to provide efficient heat dissipation, the heat sink can protect components from thermal damage and malfunction while also extending their service life. This heat sink is widely used in the medical, telecommunications, automotive, aerospace, and industrial industries. Its efficient working principle consists of a base and fins made of aluminum or copper alloy, and a thermal interface material for bridging the gaps. All these elements put together make the ATS-06B-38-C3-R0 thermal-heat sink an incredibly useful tool in all thermal management applications.

The specific data is subject to PDF, and the above content is for reference