| Allicdata Part #: | ATS-06B-64-C1-R0-ND |
| Manufacturer Part#: |
ATS-06B-64-C1-R0 |
| Price: | $ 3.77 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06B-64-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.42405 |
| 30 +: | $ 3.23358 |
| 50 +: | $ 3.04340 |
| 100 +: | $ 2.85314 |
| 250 +: | $ 2.66293 |
| 500 +: | $ 2.47272 |
| 1000 +: | $ 2.42517 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.36°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Introduction
The ATS-06B-64-C1-R0 is a high efficiency, cost-effective thermal-heat sink designed for high power applications. It is an ideal solution for thermal management in small, medium, and large central and remote cooling systems. The ATS-06B-64-C1-R0’s high performance design incorporates a number of advanced features such as high quality aluminum finned radiators, a fan system, heat pumps, and optimized air flow direction. Thermal-heat sinks are used in a variety of applications including heaters, processors, power supplies, and other electronic components.
Application Field
The ATS-06B-64-C1-R0 thermal-heat sink offers a powerful solution for applications requiring high heat dissipation. This product is designed to function in extremely high temperatures. Its aluminum fins effectively and efficiently dissipate heat in a variety of environments, including hot climates. The fan system is optimized for operation at full static load. This results in improved thermal performance at various ambient temperatures. This thermal-heat sink can be used with various process and power electronics in medical, industrial, and consumer applications.
The ATS-06B-64-C1-R0 can also be used to improve the thermal characteristics of specific electronic components. For example, it can be used in combination with a heat sink to improve heat dissipation from power amplifiers. When using a thermal-heat sink in this type of application, it is important to consider the airflow direction. Positioning the thermal-heat sink in the correct direction will allow for improved thermal efficiency.
Working Principle
The ATS-06B-64-C1-R0 thermal-heat sink utilizes a number of techniques to dissipate heat in a variety of applications. It features an efficient finned radiator design that increases heat transfer surface and air flow. This design helps to improve the overall heat dissipation efficiency. The ATS-06B-64-C1-R0 also incorporates a fan system which is optimized for full static load. This helps to ensure that the thermal-heat sink is able to operate at its full potential, even in very hot environments.
The ATS-06B-64-C1-R0 also features a heat pump to assist with thermal regulation. The heat pump is designed to reduce the amount of power consumed by the system, while still providing efficient thermal regulation. This helps to reduce the overall costs associated with operating the thermal-heat sink.
Conclusion
The ATS-06B-64-C1-R0 thermal-heat sink is an ideal solution for applications requiring high power. It is an efficient and cost-effective solution for thermal management in small, medium, and large cooling systems. The thermal-heat sink utilizes a variety of advanced techniques to provide excellent thermal performance in a variety of environments. It features an aluminum finned radiator design, a fan system, a heat pump, and optimized air flow direction. The ATS-06B-64-C1-R0 is an excellent choice for applications such as heaters, processors, and power supplies.
The specific data is subject to PDF, and the above content is for reference