| Allicdata Part #: | ATS-06B-76-C3-R0-ND |
| Manufacturer Part#: |
ATS-06B-76-C3-R0 |
| Price: | $ 3.51 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X25MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06B-76-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.18591 |
| 30 +: | $ 3.09981 |
| 50 +: | $ 2.92774 |
| 100 +: | $ 2.75549 |
| 250 +: | $ 2.58325 |
| 500 +: | $ 2.49714 |
| 1000 +: | $ 2.23882 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.84°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management has been an increasing concern for electronics due to ongoing miniaturization of components and increase in power density. ATS-06B-76-C3-R0 heat sink is a vital product for thermal management which is designed to provide optimal thermal performance and heat dissipation. The thermal interface material used in this product provides best combination of thermal cycling performance and emissivity in a wide range of temperature. The low profile design of the heat sink provides superior heat transfer utilizing fins and base plate.
The ATS-06B-76-C3-R0 heat sink features a compact design and is made of aluminum which features lightweight, low cost, corrosion resistance and efficient heat dissipation. It has a height of 6.20mm and a maximum width and depth of 76mm X 76mm respectively. This heat sink also incorporates a snap-in design that requires no additional components to install. The application field includes medium to slightly higher powered components such as high voltage converters, switching regulators, DC/DC converters, voltage regulators, DC-AC inverters and others.
The working principle of ATS-06B-76-C3-R0 heat sink is based on convection. Its profile and design are specially designed to offer optimal thermal performance and heat dissipation. To dissipate heat in a significant way, airflow is essential which is provided by mounting the heat sink on to a PCB or a heat sink assembly. The air flows through the finned section of the heat sink, absorbs heat from the base plate and the fins, dissipates the heat into the atmosphere with the help of surrounding objects.
To ensure maximum efficiency of the heat sink, heat dissipation from the fins is combined with air convection. The effective thermal performance of ATS-06B-76-C3-R0 heat sink is accomplished by the high thermal conductivity of aluminum and the finely designed surface area of the heat sink. The highly efficient thermal performance of this product makes it suitable for medium to slightly higher powered components. Additionally, its low profile design ensures minimum spacing on the PCB.
In a nutshell, the ATS-06B-76-C3-R0 is a highly efficient heat sink suitable to optimize thermal performance of medium to slightly higher powered components. It features a lightweight and cost-effective design, depending on the thermal requirements of the application. Its slim construction and snap-in design utilizes air convection to dissipate heat into the surrounds, making it an ideal choice for thermal management.
The specific data is subject to PDF, and the above content is for reference