| Allicdata Part #: | ATS-06C-10-C3-R0-ND |
| Manufacturer Part#: |
ATS-06C-10-C3-R0 |
| Price: | $ 3.93 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06C-10-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.57399 |
| 30 +: | $ 3.37554 |
| 50 +: | $ 3.17696 |
| 100 +: | $ 2.97845 |
| 250 +: | $ 2.77989 |
| 500 +: | $ 2.58133 |
| 1000 +: | $ 2.53168 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal management is an important aspect to consider when designing heat-generating components and systems. Heat sinks are one of the most commonly used methods of thermal management. The ATS-06C-10-C3-R0 is one of the most popular thermal-management solutions for addressing thermal issues in how-generating components and systems. This article will discuss ATS-06C-10-C3-R0 application field and working principle.
A heat sink is a passive device that is used to dissipate heat from a heat generating component or system. The ATS-06C-10-C3-R0 is a highly efficient heat sink that has a very low thermal resistance and a flat surface that can effectively dissipate heat. Its unique construction also allows for easy installation and removal from the system.
The ATS-06C-10-C3-R0 is commonly used in high-end electronic systems such as CPUs and GPUs. These systems tend to generate large amounts of heat, and the ATS-06C-10-C3-R0 is perfect for dissipating the heat away from the components. It can also be used in LED lighting fixtures, solar cells, server-room air-conditioners, and various other electronic devices.
The ATS-06C-10-C3-R0 has a large fin structure which provides excellent heat transfer. The fins are shaped in a way that increases the surface area, thereby increasing the heat dissipation. The fins also help to circulate the air around the unit, further aiding in cooling performance. In addition, the device has die-cast aluminum material which helps to quickly dissipate the heat.
The ATS-06C-10-C3-R0 also has several features that make it a great thermal-management solution. It has an optimal airflow design which helps to ensure that the device stays cool. It also has a low-profile design which makes it perfect for tight spaces. Its slim design also ensures that the device does not obstruct airflow around the system. The device also has a sturdy construction which ensures that the device does not have any stress fractures over time.
The ATS-06C-10-C3-R0 also has several mounting options which increase its versatility. It has several mounting holes and brackets which can be used to mount the device on any system. Additionally, it can also be mounted into a system using clips. This allows for easy installation and removal of the device when needed.
In conclusion, the ATS-06C-10-C3-R0 is a great thermal-management solution for addressing heat issues in heat-generating components and systems. It is highly efficient and can easily dissipate large amounts of heat. Its slim design and mounting options make it perfect for tight spaces, and its sturdy construction ensures that the device will not suffer from any stress fractures over time. Overall, it is one of the best heat-sinks available for thermal management.
The specific data is subject to PDF, and the above content is for reference