| Allicdata Part #: | ATS-06C-11-C3-R0-ND |
| Manufacturer Part#: |
ATS-06C-11-C3-R0 |
| Price: | $ 3.83 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X10MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06C-11-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.48138 |
| 30 +: | $ 3.28818 |
| 50 +: | $ 3.09481 |
| 100 +: | $ 2.90134 |
| 250 +: | $ 2.70791 |
| 500 +: | $ 2.51449 |
| 1000 +: | $ 2.46614 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.86°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sink thermal solutions are a mainstay of industrial cooling solutions. They are widely used for air and liquid cooled systems as they provide high power dissipation in a minimal space requirement. The ATS-06C-11-C3-R0 heat sink is a perfect example of how effective a thermal solution can truly be and its scope of application and working principles that make it so.
The ATS-06C-11-C3-R0 is an extruded heat sink. This particular model is made from a highly thermally conductive aluminum alloy and has a fin-type surface that effectively dissipates heat away from the source. Its fins are held together by longitudinal pins that create channels along the length of the sink, allowing any excess heat to be quickly dissipated from the device it protects. This kind of heat sink has the added advantage of being lightweight and easily installed, making it a popular choice for many industrial cooling systems.
The primary purpose of the ATS-06C-11-C3-R0 is to transfer heat away from a source with the help of a medium such as air or liquid. The device works by using the fins of the heat sink to increase the surface area in contact with the medium. This causes the medium to absorb more heat from the source than it would without the sink, effectively cooling it. The fins also act as a barrier that directs airflow or fluid towards any heat-producing components. This design enhances the effectiveness of the sink as it concentrates heat dissipation in the direction of the flow, thus providing an efficient and uniform cooling system.
The ATS-06C-11-C3-R0 heat sink is primarily designed for air and liquid cooled systems and is suitable for industrial, domestic, and commercial applications. It is usually used to cool processors, voltage regulators, transistors, and other chip mounted devices. It can be used in a wide variety of platforms and can integrate seamlessly with almost any air or liquid cooled system. Its low profile design makes it ideal for use in a variety of spaces.
The ATS-06C-11-C3-R0 heat sink is an effective thermal solution that provides reliable cooling for industrial and commercial applications. With its lightweight construction, high power dissipation, and versatile design, it is an excellent choice for efficient and effective thermal management. Its fins help direct airflow or liquid to target heat generating components while its low profile design allows for integration with a variety of platforms.
The specific data is subject to PDF, and the above content is for reference