ATS-06C-117-C1-R0

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal-heat sinks are one of the most important components of any electronic device. As such, it is essential to understand the application field and working principle of a particular thermal-heat sink model, such as the ATS-06C-117-C1-R0.

In general, a thermal-heat sink is a device that is attached to an electronic component, such as a transistor or an integrated circuit, in order to dissipate heat away from it, thus helping to keep the device within its optimal temperature range. This is particularly important in electronic devices that are operating at high temperatures, such as those found in server rooms or datacentres, as overheating can cause significant damage to the device, or even a complete failure.

The ATS-06C-117-C1-R0 is a thermal-heat sink that is specifically designed to dissipate heat away from sensitive semiconductor components less than 3.125” in length. It is capable of providing up to 125W of thermal dissipation and operates over a wide range of temperatures, from -25°C to +125°C. The thermal-heat sink is constructed from a copper base plate, which is then coated in gold and nickel layers for enhanced thermal performance. The gold layer also helps to protect the base plate from oxidization, ensuring long-term performance and durability. The integrated heat sink base also has built-in clip-and-sink connections for flexible mounting, making it easy to install in any application.

To work effectively, the ATS-06C-117-C1-R0 uses a combination of convection and conduction. Convection is the transfer of heat away from the hottest part of the device (the base plate) into the cooler air around it; this hot air then rises, dissipating the heat. Conduction, on the other hand, is the transfer of heat from the base plate of the device to the metal fins of the heat sink, which act as a heat sink and dissipate the heat away from the device. In addition, the device also uses forced convection, where a fan is used to actively cool the device by forcing hot air out of the device.

The ATS-06C-117-C1-R0 is extremely versatile and is suitable for use in a wide range of applications. It can be used to cool processors, power supplies, and other power components in servers, workstations, and PCs, as well as providing cooling for telecommunications systems, medical systems, and automotive components. In addition, it can also be used in industrial applications, where it may be used to cool such things as transistors, motors, pumps, and generators.

Overall, the ATS-06C-117-C1-R0 is an excellent example of a thermal-heat sink that is capable of providing the necessary thermal dissipation required for many different applications. Its combination of convection, conduction, and forced convection provides it with the necessary levels of cooling, while its durable construction ensures long-term reliability. As such, it is an ideal thermal-heat sink for use in a range of different applications.

The specific data is subject to PDF, and the above content is for reference