| Allicdata Part #: | ATS-06C-124-C1-R0-ND |
| Manufacturer Part#: |
ATS-06C-124-C1-R0 |
| Price: | $ 3.49 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06C-124-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.17394 |
| 30 +: | $ 3.08826 |
| 50 +: | $ 2.91677 |
| 100 +: | $ 2.74516 |
| 250 +: | $ 2.57363 |
| 500 +: | $ 2.48783 |
| 1000 +: | $ 2.23047 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 3.16°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal- heat sinks are one of the most important components in all types of electric, communication and industrial machines. The ATS-06C-124-C1-R0 thermal-heat sink is designed to maximize heat dissipation while minimizing the size of a package. Manufactured from aluminum alloy with either brushed or black anodized finish, the ATS-06C-124-C1-R0 sink has optimized fins for best thermal performance.
The application field of ATS-06C-124-C1-R0 thermal-heat sink mainly covers electronic and communication systems. It is suitable for power supply system such as AC/DC rectifier, DC/DC converter, DC/AC inverter, switching power supply etc. It is also very popular for the cooling of high power transistors, diode modules, motor drivers, and other electronic components.
The working principle of ATS-06C-124-C1-R0 thermal-heat sink is very simple. Heat generated by the electronic components is conducted away by a combination of a heat source, thermal interface material, and one or more heat sink fins. The thermal interface material acts as a heat conductor between the heat source and the function of the heat sink. The heat dissipates into air and is dispersed by the fins in the sink. Heat sinks are usually made from aluminum because it is lightweight but at the same time has high thermal conductivity. To maximize the sink’s ability to transfer heat away from the component, it is important to ensure that the sink is in contact with the heat source.
The ATS-06C-124-C1-R0 thermal-heat sink also comes with a range of features that make it suitable for most applications. The sink offers an efficient heat transfer with epoxy resin coating for increased fidelity and insulation. It also provides reliable thermal performance, low thermal resistance and improved cooling capacity with high thermal conductivity.
In conclusion, the ATS-06C-124-C1-R0 thermal-heat sink is an ideal choice for electronics and communication systems. It offers great thermal performance and is designed to maximize heat dissipation while minimizing the size of a package. With its epoxy resin coating, the sink also provides improved insulation and fidelity for a reliable thermal performance. The combination of lightweight material and high thermal conductivity make it suitable for a wide range of applications.
The specific data is subject to PDF, and the above content is for reference