ATS-06C-126-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-06C-126-C1-R0-ND

Manufacturer Part#:

ATS-06C-126-C1-R0

Price: $ 3.51
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X15MM XCUT
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-06C-126-C1-R0 datasheetATS-06C-126-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.18591
30 +: $ 3.09981
50 +: $ 2.92774
100 +: $ 2.75549
250 +: $ 2.58325
500 +: $ 2.49714
1000 +: $ 2.23882
Stock 1000Can Ship Immediately
$ 3.51
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.590" (15.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 5.45°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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Thermal - Heat Sinks

The ATS-06C-126-C1-R0 is part of the thermal engineering field. The ATS-06C-126-C1-R0 is a heat sink device used to control heat through conduction and convection. The device consists of a metal frame that is used to quickly dissipate heat from the components in an electronic device. Heat sinks are a key component in the cooling of electronic circuits as excessive heat can damage components and reduce the lifespan of the system.The reason why the ATS-06C-126-C1-R0 is so efficient is because it is composed of a metal material that provides excellent heat conduction and excellent mechanical strength. The material is specifically designed for device cooling applications. The device’s design also increases the overall surface area of the device in order to provide increased cooling efficiency. This increased surface area also helps to reduce the temperature gradient across the device.The ATS-06C-126-C1-R0 works by dissipating the heat generated by components in the electronic device. This heat is conducted away from the components that generate it by the metal frame of the device. The heat is then dissipated into the air through convection. The metal frame of the device helps to increase the rate of heat dissipation by increasing the surface area of the device. The increased surface area of the device also helps to reduce the temperature gradient across the device.The ATS-06C-126-C1-R0 is a versatile device that can be used for many different applications. The device is able to provide efficient cooling for components in electronic devices such as cell phones, laptops, and other electronic devices. The device is also suitable for controlling the temperature of components in industrial machines such as 3D printers, robotics, and other machines that generate high levels of heat.The ATS-06C-126-C1-R0 is an effective and reliable tool for temperature control and managing thermal energy in electronic devices. With its efficient design and versatile applications, the ATS-06C-126-C1-R0 is the perfect choice for controlling temperatures in electronic devices. The device is able to provide efficient cooling and temperature control for many different applications. By using the ATS-06C-126-C1-R0, electronic devices can operate more efficiently and at a lower risk of damage due to overheating.

The specific data is subject to PDF, and the above content is for reference

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