| Allicdata Part #: | ATS11021-ND |
| Manufacturer Part#: |
ATS-06C-15-C2-R0 |
| Price: | $ 4.52 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 50X50X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06C-15-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.11390 |
| 10 +: | $ 4.00239 |
| 25 +: | $ 3.77975 |
| 50 +: | $ 3.55748 |
| 100 +: | $ 3.33509 |
| 250 +: | $ 3.11275 |
| 500 +: | $ 2.89041 |
| 1000 +: | $ 2.83483 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.969" (50.00mm) |
| Width: | 1.969" (50.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.44°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important component of any electronic device design. Heat management and its consideration during the design and assembly of an electronic system is essential to ensure efficient functioning and to extend the lifetime of the system. Heat dissiprated by the electronic components needs to be removed effectively from the system and dispersed into its environment. This is why heat sinks are used, and ATS-06C-15-C2-R0 is a leading example in this field.
Heat sinks are devices constructed to dissipate heat away from components or systems that generate large amounts of heat. Generally they have a finned, aluminum structure that maintains a much larger surface area than the body from which the heat is being dispersed. This larger surface area efficiently radiates the heat away, providing effective thermal management.
The ATS-06C-15-C2-R0 heat sink is designed for air flow management, and offers an extensive range of features which make it suitable for a variety of applications. It has a fin density of 30 fins per inch, a black anodized finish, and is designed to dissipate a peak power of 8W. Its dimensions make it ideal for high-power applications, as it has a width of 15mm and a height of 37mm.
With regards to its working principle, the ATS-06C-15-C2-R0 relies on convection to dissipate the heat away from it. This process involves air moving past the fins as the warmer air is displaced. As the air passes across the fins, it cools down before being dispersed away from the heat sink and into its environment, effectively dispersing the heat from the component or system.
The ATS-06C-15-C2-R0 heat sink provides excellent thermal performance and is deployable in high power applications, efficiently managing heat dissipation from the component or system mounted to it. It is suitable for use in a range of different applications, including CPU coolers, power supplies, LED lighting, and more. Its superior design and specifications make it an ideal choice for any environment in which thermal management is essential.
The specific data is subject to PDF, and the above content is for reference