ATS-06C-150-C1-R0

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Heat sinks are thermal management components used to move, or transfer, unwanted heat away from heat-sensitive components such as processors, power supplies, motor controllers and other electronic components. Heat sinks are usually made from materials such as aluminum, copper or steel and are designed to disperse or dissipate heat into the surrounding environment, typically air, by conduction, radiation, or convection.

The ATS-06C-150-C1-R0 Heat Sink is a single-row heat sink typically used in applications where low profile design or small size components are desired. This heat sink is designed to dissipate heat away from processor cores, or other objects, at a high rate and is suitable for use in industrial or automotive applications. It is a highly efficient heat transfer system that features a low profile and a contact surface area that is four times larger than that of traditional heat sinks.

Working Principle

The ATS-06C-150-C1-R0 Heat Sink utilizes the principles of conduction, convection, and radiation to transfer heat away from the heat-generating components or devices. The conduction process works by transferring thermal energy to the entrance of a sink through contact with a thermal source. Typically, the contact between thermal source and sink is made via a thermal bridge, such as a thermally conductive pad or thermal tape. Once thermal energy enters the sink, the energy spreads throughout the body of the sink via conduction.

The convection process occurs when thermal energy is moved by air or fluid currents (such as those within a fan). This movement, or convection, is created by a difference in density. When thermal energy passes through the air or fluid, the molecules within the air or fluid move in an organized motion, or convection current. This convection current helps to transfer thermal energy away from the heat generating source.

The ATS-06C-150-C1-R0 Heat Sink also features an integrated fan for added efficiency when transferring heat away from processor cores. The fan helps to draw air to and around the sink generating convection currents that further assist with the heat transfer process. The fan also boosts the thermal transfer by providing air flow over the sunk’s surface to assist in the cooling process.

Lastly, radiation is a process by which thermal energy is transferred away from the heat-generating source by electromagnetic waves. The ATS-06C-150-C1-R0 Heat Sink has an optimized fin surface geometry which helps to maximize radiation transfer. The fins of the heat sink serve to increase the surface area which helps to dissipate thermal air more quickly.

Application Field

The ATS-06C-150-C1-R0 Heat Sink is designed to be used in applications where low profile designs or small size components are desired. It is widely used in industrial and automotive applications, as well as medical and consumer electronics. The ATS-06C-150-C1-R0 Heat Sink is typically used in applications such as microprocessors, power supplies, motor controllers, and other electronic components where quick and efficient heat dispersion is needed.

The ATS-06C-150-C1-R0 Heat Sink is designed to be used in a variety of environments. Its low profile design makes it suitable for use in a variety of applications. It is highly resistant to corrosion and oxidation due to its compact size and is capable of dissipating heat at a much faster rate than traditional heat sinks. The ATS-06C-150-C1-R0 Heat Sink is designed to be used in applications where fast, efficient, and reliable heat transfer is needed.

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