| Allicdata Part #: | ATS-06C-153-C1-R0-ND |
| Manufacturer Part#: |
ATS-06C-153-C1-R0 |
| Price: | $ 3.45 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06C-153-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.13866 |
| 30 +: | $ 3.05361 |
| 50 +: | $ 2.88401 |
| 100 +: | $ 2.71435 |
| 250 +: | $ 2.54470 |
| 500 +: | $ 2.45987 |
| 1000 +: | $ 2.20541 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 11.93°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is a crucial component of a wide range of electrical devices and equipment, and heat sinks are a critical component of the thermal management system of various devices. The ATS-06C-153-C1-R0 is a heat sink designed to be used in a wide range of applications. Its excellent thermal performance, low profile and lightweight make it well suited for high-density applications. This article will discuss the application field and working principle of the ATS-06C-153-C1-R0.
The ATS-06C-153-C1-R0 is a small, compact, low-profile heat sink designed for applications which require a low profile and lightweight thermal solution. It features an open lattice design, with the goal of providing maximum heat dissipation capabilities while occupying minimal space. The heat sink is designed to be used in a variety of applications, such as medical electronics, industrial equipment, and aerospace and defense applications. It is also suitable for use in high-density cooling applications, such as in rack servers and other high-performance computing systems.
The ATS-06C-153-C1-R0 provides an efficient solution for heat dissipation. It is designed to dissipate heat quickly and evenly throughout its entire surface. The heat sink is constructed from a combination of aluminum alloy and copper alloys, which are thermally and electrically conductive. This combination ensures optimal thermal performance and low thermal resistance, meaning that the heat sink is able to dissipate heat effectively and efficiently. The thermal resistance of the heat sink can be further optimized by adding an additional thermal gap filler or thermal pad in between the heat sink and the component it is cooling.
The ATS-06C-153-C1-R0 heat sink also features a built-in fan, which ensures that air can circulate around the heat sink, providing effective and efficient cooling. The fan is designed with low-noise operation in mind, making it an excellent choice for applications which require low noise levels. The fan is powered using a standard 12V DC power connector, making it compatible with a wide variety of devices.
The ATS-06C-153-C1-R0 heat sink is designed to be used in a range of high-density cooling applications. It is also suitable for use in medical electronics, industrial equipment, aerospace and defense applications. Due its small size, low profile and lightweight design, it is the ideal choice for a variety of applications requiring efficient thermal management solutions. The open lattice design of the heat sink provides maximum heat dissipation while occupying minimal space, and the addition of an internal fan ensures effective cooling.
In summary, the ATS-06C-153-C1-R0 is a small, lightweight heat sink with an open lattice design. It is well suited for applications which require a low profile and lightweight thermal solution. The combination of aluminum alloy and copper alloys ensures excellent thermal performance and low thermal resistance, while the addition of an internal fan ensures effective cooling. The heat sink is suitable for use in a variety of applications, including medical electronics, industrial equipment, and aerospace and defense applications, making it an ideal choice for high-density cooling needs.
The specific data is subject to PDF, and the above content is for reference