Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.772" (45.00mm)
Width:	1.772" (45.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.378" (35.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	2.39°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks

ATS-06C-164-C1-R0 Application Field and Working Principle

The ATS-06C-164-C1-R0 is a type of thermal heat sink that is primarily used in electronic equipment and other high-powered, temperature-sensitive devices. It is an efficient and reliable thermal management technology that is used to dissipate heat from the components of an electronic device. This technology can be used in a range of applications, such as computer hardware, automotive systems, medical equipment, and consumer electronics.A heat sink is a device designed to move heat away from an electronic component and dissipate it into the ambient environment. It is typically an aluminum plate that has a finned or otherwise structured surface to maximize its surface area for a given volume. The ATS-06C-164-C1-R0 is a type of thermal heat sink that integrates with a resistor, hence its name. This resistor is responsible for dissipating the heat generated by the electronic component, rather than transferring it directly to the copper contact plates.When an electronic component produces heat, it is dissipated through the fins of the ATS-06C-164-C1-R0, into the air. The copper contact plates are responsible for absorbing the heat and creating a thermal bridge between the component and the thermal heat sink. This thermal bridge allows the heat to be efficiently transferred and dissipated from the component.The thermal heat sink works in unison with the resistor to dissipate the heat generated by the component. The resistor includes a series of loops connected in parallel to drain off excess heat. This works to both reduce the temperature of the heat sink, while also providing protection from potential overloads and other hazards.The ATS-06C-164-C1-R0 has a low thermal mass, which means that it is able to quickly and efficiently dissipate the heat generated by the component, while also providing excellent protection from potential damage caused by excessive temperatures. Additionally, its versatility in different applications and its ability to integrate with a range of components makes it a popular choice for many different types of applications.The ATS-06C-164-C1-R0 is an excellent choice for a variety of temperature-sensitive applications. Its thermal conductivity, low thermal mass and resistance to mechanical damage make it reliable and efficient, while its size and flexibility make it suitable for numerous applications. It is a dependable and efficient solution for many applications.

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