| Allicdata Part #: | ATS-06C-175-C3-R0-ND |
| Manufacturer Part#: |
ATS-06C-175-C3-R0 |
| Price: | $ 3.78 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 35X35X10MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06C-175-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.43539 |
| 30 +: | $ 3.34278 |
| 50 +: | $ 3.15706 |
| 100 +: | $ 2.97140 |
| 250 +: | $ 2.78568 |
| 500 +: | $ 2.69282 |
| 1000 +: | $ 2.41425 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.378" (35.00mm) |
| Width: | 1.378" (35.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.65°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management solutions are integral to the operation of modern electronics. Heat sinks, specifically, are an important component of a thermal solution and have an enormous array of applications. The ATS-06C-175-C3-R0 is a type of heat sink developed by Atsuji Thermal Science Corporation that is designed for rapid heat transfer and heat dissipation. This thermal solution is widely used in a range of applications, of both consumer and industrial grade.
The ATS-06C-175-C3-R0 is a flat-topped heat sink with a radial fin design. It uses an anodized aluminum alloy and has a thermal resistance of 0.33°C in still air conditions. It is relatively lightweight at 7.4 oz., yet extremely efficient in its heat dissipation needs. It measures 1.74” in height and height is a very important parameter for sizing a heat sink for an application. Its base size measures 1.38” square, with a 5/8” hart/hex and M3.5 fastener holes.
The ATS-06C-175-C3-R0 has an application field of both industrial and consumer grade electronics. With its wide range of uses, it can easily be incorporated into many systems. It is most commonly used in the PC-OEM and storage appliance markets where its low thermal resistance, light weight, and cost-effectiveness make it an ideal choice. Additionally, the ATS-06C-175-C3-R0 can be used in consumer electronics such as tablets and laptops. Its size and design is perfect for use in these devices, and its lightweight design allows for easy installation.
The working principle of the ATS-06C-175-C3-R0 is very simple. Heat is produced when an electronic device is in use and, to ensure proper operation, it must be transferred away from the component and dissipated into the surroundings. Heat sinks are designed to facilitate this process by increasing the surface area of the component and creating a larger surface area where the heat can be dissipated. The air exchange system of the ATS-06C-175-C3-R0 uses a mixture of convection and radiation to dissipate the heat into the surrounding air. The increased air exchange rate allows for faster heat dissipation, thus improving the thermal performance of the system.
The ATS-06C-175-C3-R0 is a simple, yet highly efficient thermal solution designed for a wide variety of applications. It is perfect for use in industrial and consumer grade electronics, providing improved thermal performance in a lightweight and cost-effective package. Its design allows it to easily handle a wide range of heat levels and its air exchange system ensures that the heat is dissipated quickly and effectively. The ATS-06C-175-C3-R0 is a great choice for any thermal management solution.
The specific data is subject to PDF, and the above content is for reference