| Allicdata Part #: | ATS-06C-181-C3-R0-ND |
| Manufacturer Part#: |
ATS-06C-181-C3-R0 |
| Price: | $ 3.91 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X10MM R-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06C-181-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.55131 |
| 30 +: | $ 3.35370 |
| 50 +: | $ 3.15643 |
| 100 +: | $ 2.95917 |
| 250 +: | $ 2.76189 |
| 500 +: | $ 2.56462 |
| 1000 +: | $ 2.51530 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.394" (10.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.06°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks
Heat sinks are a very important part of any electronic device. The ATS-06C-181-C3-R0 is a type of heat sink that excels in its application and is used in many applications. It is created to absorb heat from electronic components and dissipate it to other parts of the device, keeping it cool and operational. Understanding the working principle and application field of the ATS-06C-181-C3-R0 can help you decide if it is the right heat sink for your project.
Working Principle of the ATS-06C-181-C3-R0
The ATS-06C-181-C3-R0 is a traditional heat sink that is actively cooled. Its main components are a base, a radiator and a fan. The base is an aluminum plate that is attached to the electronic component that needs cooling. Heat is generated by the component and is transferred to the base. The heat is then moved through the radiator that is attached to the base.
The heat is moved to the radiator through a process called conduction. The heat is then moved to the fan, which is attached to the radiator. This fan is responsible for dissipating the heat away from the electronic component. The fan forces air across the fins of the radiator, cooling the heated air and dispersing it away from the electronic device. This entire process maintains the temperature of the electronic components and keeps them running smoothly and safely.
Application Field of the ATS-06C-181-C3-R0
The ATS-06C-181-C3-R0 is mainly used in industrial applications, but it can also be used in non-industrial settings. It is particularly well suited to applications with limited space. The ATS-06C-181-C3-R0 is relatively small and lightweight compared to other heat sinks, making it ideal for applications in tight spaces. It is also quite efficient, allowing it to dissipate thermal energy quickly and efficiently.
This type of heat sink is commonly used in industrial applications such as manufacturing or laboratory testing. These applications require reliable and efficient cooling to ensure that the components are working smoothly and without failure. The ATS-06C-181-C3-R0 is also often used in consumer electronics where cooling is needed to protect from overheating.
The ATS-06C-181-C3-R0 is a reliable and efficient heat sink that is able to dissipate thermal energy quickly and efficiently, thus reducing the temperature of the electronic components. Understanding the working principle and application field of this type of heat sink can help you decide if it is the right one for your project.
The specific data is subject to PDF, and the above content is for reference