ATS-06C-185-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-06C-185-C3-R0-ND

Manufacturer Part#:

ATS-06C-185-C3-R0

Price: $ 4.32
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X30MM R-TAB T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-06C-185-C3-R0 datasheetATS-06C-185-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.88647
30 +: $ 3.67059
50 +: $ 3.45467
100 +: $ 3.23870
250 +: $ 3.02279
500 +: $ 2.80687
1000 +: $ 2.75290
Stock 1000Can Ship Immediately
$ 4.32
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 1.181" (30.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 3.45°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal heat sinks are important components in many types of electronic applications, as they provide some of the most efficient and effective ways of dissipating heat from hot spots in a controlled manner. The ATS-06C-185-C3-R0 is a thermal heat sink designed for use in many different electronic applications. The ATS-06C-185-C3-R0 is constructed from aluminum and designed to effectively dissipate heat from hot spots in a controlled manner.

The ATS-06C-185-C3-R0 features a combination of radiative and convective technologies that allows for effective heat dissipation from both horizontal and vertical mounting positions. The ATS-06C-185-C3-R0 has a die-cast aluminum base which helps to provide more efficient heat transfer than other thermal heat sinks. The aluminum base is also anodized for enhanced durability. On top of the base there is a heat sink plate which has fins with a curved profile that helps to dissipate heat away from the component. The ATS-06C-185-C3-R0 also features an epoxy-coated, steel-shelled protection tube, which helps to further protect the heat sink from dust, dirt, and any other environmental damage or corrosion.

The ATS-06C-185-C3-R0 also features mounting clips for easy installation. This thermal heat sink is suitable for use in a variety of electronic devices such as microprocessors, data storage, medical imaging, and more. The ATS-06C-185-C3-R0 is designed to optimize thermal management in these types of applications. In addition to having a large thermal capacity, the ATS-06C-185-C3-R0 also features low fan noise and low airflow resistance. This makes it the ideal choice for applications that require quiet operation but also require a reliable and efficient way to dissipate heat from the hot spots.

The ATS-06C-185-C3-R0 is designed to work on the principle of convection. The aluminum base and heat sink plate are designed to absorb and dissipate heat away from the component. This is done by having the fins of the heat sink plate create a larger surface area which allows more heat to be absorbed and dissipated away from the component. As the heat is dissipated away from the component, the cooler air around the heat sink will replace the warmer air, resulting in a cooling effect.

The ATS-06C-185-C3-R0 also utilizes a radiative technology to further boost its efficiency. The aluminum base and heat sink plate of the ATS-06C-185-C3-R0 are both coated with a black epoxy coating that helps to absorb and emit infrared radiation, which helps to further reduce the surface temperature of the component. This means that the ATS-06C-185-C3-R0 is able to provide reliable cooling even in cases where the ambient temperature is higher than the maximum operating temperature of the component.

The ATS-06C-185-C3-R0 is an effective and efficient thermal heat sink that is designed for a variety of applications. Its combination of radiative and convective technologies helps to ensure that heat is dissipated away from the component in a reliable and efficient manner, making it an ideal choice for applications that need reliable thermal management. The ATS-06C-185-C3-R0 is designed to optimize thermal management in applications where low fan noise is essential and is effective even when used in high ambient temperature environments.

The specific data is subject to PDF, and the above content is for reference

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