| Allicdata Part #: | ATS-06C-210-C3-R0-ND |
| Manufacturer Part#: |
ATS-06C-210-C3-R0 |
| Price: | $ 6.57 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X12MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06C-210-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 5.91066 |
| 30 +: | $ 5.58222 |
| 50 +: | $ 5.25395 |
| 100 +: | $ 4.92553 |
| 250 +: | $ 4.59716 |
| 500 +: | $ 4.26879 |
| 1000 +: | $ 4.18670 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.24°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
ATS-06C-210-C3-R0 thermal heat sinks are an essential component used to facilitate efficient cooling systems in a variety of electronic applications. A heat sink is a device comprised of a metal body that dissipates the heat generated by an electronic device to the surrounding environment using convection. Heat sinks help maintain temperatures within the specified operating range of most electronic components, thus ensuring their reliable operation. In order to prevent overheating and reduce the risk of failure, thermal heat sinks are highly recommended for any application that contains high-powered thermal loads such as power amplifiers, LED drivers, control circuits, and other related components.
Heat sinks are constructed with a base, fins, and air channels or heat pipes. The base is used to support and contact the component providing stability. The fins along with its surface area increases the ability to cool the component by facilitating better airflow. Last, but not least, the heat pipes, also known as vapor chambers, are integrated to provide efficient thermal transfer.
ATS-06C-210-C3-R0 thermal heat sinks utilize a patented ribbed fin design, combined with strong aluminum alloy construction for optimal heat dissipation. This thermal heat sink has a mounting height of 22.9mm, a base area of 57.5 mm x 79.9 mm, and a fin area of 202.5 mm x 118 mm. It comes with an integrated mounting bracket and fan clips for fast and easy installation. Furthermore, this thermal heat sink is RoHS compliant, and UL listed, so it is safe to use in a variety of applications.
The main purpose of thermal heat sinks is to transfer the heat away from the component and ensure more efficient operation. They are extremely effective in reducing the temperature of components by dissipating the heat that is generated through the fins. Thermal heat sinks are usually used in applications that require increased cooling capability such as in high-power amplifiers, LED drivers, and control circuits.
Heat loss is an essential factor in building efficient cooling systems. The more effective a heat sink is, the more heat it can dissipate. In order to maximize the efficiency, it is important to choose the right type of thermal heat sink with the correct thermal performance and power rating. The ATS-06C-210-C3-R0 is a great choice for applications that require enhanced thermal performance and increased cooling capabilities.
The specific data is subject to PDF, and the above content is for reference