ATS-06C-42-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Rectangular, Fins
Length:	2.280" (57.90mm)
Width:	2.400" (60.96mm)
Diameter:	--
Height Off Base (Height of Fin):	0.900" (22.86mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	7.30°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal management is a crucial component of any modern electronic systems. Heat sinks are the most common type of thermal management device used to dissipate heat generated by the operation of an electronic device. The ATS-06C-42-C1-R0 is a universal heat sink manufactured by Advanced Thermal Solutions, Inc. (ATS). This article will provide an overview of the ATS-06C-42-C1-R0’s application fields and working principle.

Application Fields

The ATS-06C-42-C1-R0 is designed to effectively dissipate heat generated by high power electronic components such as high-performance processors, SoC, GPUs, RAMs, I/O controllers, and other high-power microelectronics. The device is highly versatile and can be used in a variety of devices including gaming consoles, notebooks, PC motherboards, industrial computers, and other electronic equipment.The ATS-06C-42-C1-R0 has a small footprint, making it an ideal choice for applications where space is limited. Its lightweight properties ensure that the device does not add unnecessary complexity to the design and it is easy to install and maintain. The device has a universal mounting system which makes it compatible with all types of processors, motherboards, and other components. The ATS-06C-42-C1-R0 was designed to maximize the heat dissipation of its components without sacrificing the thermal reliability of the device’s components. The heat sink utilizes thermally conductive aluminum fins combined with a triple metal pin finned base to ensure optimal dissipation of heat generated by its components. Its base also includes two convex grooves in order to dissipate the heat generated in the center of its base.

Working Principle

The ATS-06C-42-C1-R0 is a highly efficient, universal heat sink that dissipates heat generated by its components efficiently and reliably. The device comprises a combination of aluminum fins and a triple metal pin finned base, with a base layer that is composed of a special, thermally conductive compound. The aluminum fins and base layer are designed to transfer the heat generated from its components into the ambient air.The ATS-06C-42-C1-R0 utilizes thermally conductive aluminum fins to dissipate the heat generated by its components. The aluminum fins are designed to conduct the heat generated by its components away from the device’s components and into the surrounding air. As the air passes across the aluminum fins, it absorbs the heat that is generated by the device’s components, dissipating it into the environment. The device also features a triple metal pin finned base. The base is composed of three metal pins, each of which is embedded in a die-cast aluminum base. The base layer of the device consists of an electrically conductive compound that is designed to create a highly efficient heat conduction path between the device’s components and the aluminum fins. This ensures that the heat generated by the device’s components is efficiently transferred into the surrounding air. The ATS-06C-42-C1-R0 also features two convex grooves on its base layer, which are designed to dissipate the heat that is generated in the center of its base. The grooves are designed to improve the thermal conductivity of the base layer by providing additional pathways for the heat to be dissipated. This ensures that the heat generated by the device’s components is efficiently dissipated into the surrounding air.

Conclusion

The ATS-06C-42-C1-R0 is a highly efficient, universal heat sink designed to efficiently and reliably dissipate the heat generated by its components. The device utilizes thermally conductive aluminum fins and a triple metal pin finned base to ensure optimal heat dissipation of its components. The device also features two convex grooves on its base layer to further improve its thermal conductivity. The ATS-06C-42-C1-R0 is an ideal choice for applications where space is limited and for applications where high power is required.

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