ATS-06C-47-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.181" (30.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	9.58°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Heat sinks are devices designed to manage and control thermal energy in electronic components to improve their lifespan and efficiency. The heat sink, ATS-06C-47-C3-R0, is one of the best thermal management solutions for applications requiring high performance and quality cooling. This article explains the application field and working principle of the ATS-06C-47-C3-R0 heat sink.The ATS-06C-47-C3-R0 heat sink is ideal for use in demanding electric and electronic applications where thermal management is critical. This heat sink is constructed with a combination of high performance graphite and aluminum alloy materials, which make it great for dissipating high levels of heat energy with minimal effort. Additionally, the aluminum alloy heat sink base ensures constant temperature stability, enabling more efficient cooling of electronics.The ATS-06C-47-C3-R0 heat sink is designed to provide superior thermal performance with minimal airflow required. This helps prevent electrical components from overheating when they are running at full capacity. Additionally, this heat sink also features a robust composite construction that increases thermal heat transfer while ensuring high levels of durability. This makes it an ideal choice for applications that require reliable cooling, such as computer systems, power supplies, and hard drives.The working principle of ATS-06C-47-C3-R0 heat sink follows the general law of heat dissipation. This law states that heat is transferred from one point to another through conductive and convective pathways. In the case of the ATS-06C-47-C3-R0 heat sink, the heat generated by the electrical components is first transferred to the metal base of the heat sink. From here, the heat is then conducted through the fins of the heat sink, allowing for maximum dissipation of the heat energy.The design of the ATS-06C-47-C3-R0 heat sink ensures that the thermal energy is quickly and efficiently dissipated, while also providing optimal levels of heat transfer and cooling. Additionally, the design ensures that the heat dissipates quickly without any decrease in temperature stability. This ensures that components remain cooled and will not overheat, allowing for increased reliability and performance from the components.In conclusion, the ATS-06C-47-C3-R0 heat sink is an ideal solution for applications requiring high performance thermal management. The design of the heat sink allows for maximum transfer of thermal energy while ensuring temperature stability. Additionally, the robust construction and superior thermal performance make this heat sink an ideal choice for demanding electronics applications.

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