| Allicdata Part #: | ATS-06C-50-C3-R0-ND |
| Manufacturer Part#: |
ATS-06C-50-C3-R0 |
| Price: | $ 3.54 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06C-50-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.22182 |
| 30 +: | $ 3.13467 |
| 50 +: | $ 2.96050 |
| 100 +: | $ 2.78630 |
| 250 +: | $ 2.61218 |
| 500 +: | $ 2.52510 |
| 1000 +: | $ 2.26388 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 19.22°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management plays an important role in today’s electronics industry, and choosing the right thermal solution for a specific application is critical to ensure reliable performance. The ATS-06C-50-C3-R0 is a thermal heat sink designed for use with TO-220 packages. This device is ideal for applications ranging from power transistors to power MOSFETs with power levels up to 350 watts. By using this thermal heat sink, users can achieve maximum performance and increased cooling even in the most demanding thermal environments.
The ATS-06C-50-C3-R0 is a heat sink designed to provide effective thermal management for power transistors and power MOSFETs. This device uses a 5.000” X 5.000” (127 x 127mm) footprint to provide adequate heat dissipation and is designed to accommodate leads up to 0.750” (19mm) in length. The ATS-06C-50-C3-R0 is constructed from aluminum and features a rugged design that offers superior thermal performance. This thermal solution is also RoHS compliant and is an ideal choice for applications that require improved thermal performance and energy efficient cooling.
The ATS-06C-50-C3-R0 uses convection cooling as its main method of thermal management. This means that heat is dissipated through the natural movement of the air created by the thermal sink’s structure. The aluminum material used in the manufacturing process helps to maximize the rate at which the heat is dissipated. Additionally, this thermal sink features a black anodized finish to help increase its functionality and durability. This provides superior corrosion resistance as well as improved long-term performance.
The ATS-06C-50-C3-R0 also uses air-cooled through-hole mounting to help ensure effective heat transfer from the component to the thermal sink. This type of air-cooled mounting makes it easier to mount the thermal sink to the component, as well as making sure that the heat created by the component is dissipated efficiently. With an easy-to-install design, the ATS-06C-50-C3-R0 is ideal for a wide variety of thermal management applications.
In summary, the ATS-06C-50-C3-R0 is a thermal heat sink designed to provide effective thermal management for power transistors and power MOSFETs. This thermal solution takes advantage of convection cooling to dissipate heat quickly and efficiently. With an easy-to-install design and an anodized finish for added durability, the ATS-06C-50-C3-R0 is an ideal choice for a wide variety of cooling applications.
The specific data is subject to PDF, and the above content is for reference