ATS-06C-55-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-06C-55-C1-R0-ND

Manufacturer Part#:

ATS-06C-55-C1-R0

Price: $ 3.21
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 35X35X10MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-06C-55-C1-R0 datasheetATS-06C-55-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 2.92446
30 +: $ 2.84550
50 +: $ 2.68733
100 +: $ 2.52926
250 +: $ 2.37119
500 +: $ 2.29216
1000 +: $ 2.05503
Stock 1000Can Ship Immediately
$ 3.21
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.378" (35.00mm)
Width: 1.378" (35.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 23.94°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Heat sinks are integral components of electronic devices which help promote the performance and lifetime of them. The ATS-06C-55-C1-R0 Heat Sink is no exception, offering a range of benefits and features for numerous applications.

This type of heat sink is made of aluminum alloy and is able to dissipate heat quickly and efficiently from a range of components. It has an additional element built into Mount-06 Series in the form of a double heat slug which is placed in between the base and the fins which have wider contact area with the air, thus enhancing the heat dissipation rate.

The ATS-06C-55-C1-R0 Heat Sink features a wide range of applications in both commercial and consumer fields due to the efficiency with which it can transfer heat. The device is well suited to be used in small electronic and digital devices such as laptop computers with limited space for air flow, helping to ensure that the device and its components do not overheat and fail prematurely. The aluminum alloy construction also helps to ensure that it remains lightweight and can easily be transported.

This heat sink has a specific working principle that is designed to make the most of its compact size. It uses natural convection, drawing heated air away from the component to which it is attached. Simultaneously, the fins of the heat sink provide an additional means of transfer of the heat via their large surface areas. This helps to accelerate the heat transfer process and cool components more quickly.

The robust construction of the ATS-06C-55-C1-R0 Heat Sink also ensures that it is able to stand up to the rigors of everyday use. This includes applications which entail subjecting electronic components to extreme temperatures or environmental conditions. The durability and ease of use makes it the perfect solution for applications such as external heating systems and power electronic applications.

The ATS-06C-55-C1-R0 Heat Sink is thus an excellent choice for cooling components in applications where space is limited and heat dissipation is paramount. Its lightweight construction and ability to draw the heated air away from components with unrivalled efficiency make it a key component in numerous thermal technologies.

The specific data is subject to PDF, and the above content is for reference

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