Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	0.984" (25.00mm)
Width:	0.984" (25.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.984" (25.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	11.84°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks

ATS-06C-76-C3-R0 Application Field and Working Principle

The ATS-06C-76-C3-R0 is a thermal heat sink designed to manage excessive temperatures created by electrical components in industrial and consumer applications. These heat sinks provide cooling for electronic circuitry used in products ranging from small consumer electronic devices to industrial motors and power supplies. Diagnostic and maintenance operation on electronic systems can be reliably and efficiently accomplished with the aid of this heat sink. The product is custom designed to meet a wide range of user applications.Heat sinks are components designed to thermally insulate areas of a device where temperatures are not desired. The ATS-06C-76-C3-R0 typically comprises of a fan, cold plate, heat pipe, and other components to efficiently remove heat from the device. Its thermal workmanship is efficient and reliable, thanks to advanced heat transfer technology. The heat sink’s design is based on forced convection of the system, and includes a fan, cold plate, and other components to draw heat away from the device. The ATS-06C-76-C3-R0 is composed of aluminum or other lightweight metal materials and is often finned or ribbed to increase its surface area. It is manufactured in custom shapes and sizes—from small, self-contained units to large, water-cooled custom designs. Through its employment, temperatures of hot components can be effectively held in check, thereby enabling consistent operation of the system. Additionally, the designed components are unique in that they are also corrosion-resistant and can withstand moderately high temperatures.The heat sink is typically designed to maximize the surface area of its components in order to ensure efficient heat transfer. It circulates air across its surface area, drawing excessive heat away from the source and cooling it down. Additionally, the efficient thermal heat transfer of the device increases the reliability and longevity of the component or system it is used with. It is also often used in combination with a heat spreader or other thermal transfer devices for increased efficiency.The ATS-06C-76-C3-R0 heat sink is designed to operate in a variety of environments. It is capable of operating with air spaces of 3mm or more and water spacing of at least 2mm to achieve optimal thermal efficiency. Additionally, the device has been designed with its fan blade surfaces in an orientation to reduce possible noise impact. Before installation, proper mounting for the device should be determined, with an understanding of the application in order to ensure minimal stress and correct positioning of the heat sink. Proper installation of the device will ensure the longevity of the component or system and provide reliable operation.In conclusion, the ATS-06C-76-C3-R0 is an efficient and reliable heat sink appropriate for a variety of consumer and industrial applications. Its advanced thermal transfer technology ensures efficient heat transfer, while its corrosion resistance and high temperature tolerance makes it suitable for various environments. Installation of the device should be done properly in order to maximize its effectiveness in cooling the device for reliable operation of the system.

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