| Allicdata Part #: | ATS-06D-10-C1-R0-ND |
| Manufacturer Part#: |
ATS-06D-10-C1-R0 |
| Price: | $ 3.61 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06D-10-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.28104 |
| 30 +: | $ 3.19242 |
| 50 +: | $ 3.01505 |
| 100 +: | $ 2.83771 |
| 250 +: | $ 2.66036 |
| 500 +: | $ 2.57169 |
| 1000 +: | $ 2.30565 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.87°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
A thermal heat sink is an essential piece of hardware used for controlling the temperatures of electronics or other devices. Used widely in a variety of industries and applications, they are often chosen to provide maximum heat transfer efficiency. The ATS-06D-10-C1-R0 heat sink is a great example of a product designed to deliver maximum performance that is truly indispensable.
Applications for ATS-06D-10-C1-R0 Heat Sink
The ATS-06D-10-C1-R0 heat sink is a versatile and cost-efficient thermal cooling solution which has a variety of applications. This type of heat sink can be used in many different industries including computer and electronics, industrial automation, medical, and other applications. It is built to provide reliable and efficient heat transfer, so it can help lower the surface temperatures of various electronics and other sensitive components in a system.
For example, the ATS-06D-10-C1-R0 heat sink can be used in medical applications including patient monitoring systems, medical imaging systems, medical air movements, and other applications. In these applications, the heat sink helps to keep the system at a lower temperature, allowing the products to deliver better performance and increased reliability. Additionally, the ATS-06D-10-C1-R0 heat sink is also used in industrial automation and other power-intensive applications. Here, it helps to maintain working temperatures that are optimum for high performance and improved longevity of the equipment.
Working Principle of ATS-06D-10-C1-R0 Heat Sink
The ATS-06D-10-C1-R0 heat sink is built to provide maximum heat transfer efficiency. This happens by using a combination of surface area, air flow, and thermal insulation to dissipate the heat away from the component into the heat sink. A fan is typically used to circulate the air around the product, which helps to keep the component cool and its temperature in an ideal range.
The ATS-06D-10-C1-R0 heat sink is designed to be efficient, lightweight, durable and reliable. It features a variety of shapes and sizes to maximize its performance in different applications. This includes high-pressure extrusion molding technology to provide maximum heat transfer effect. Additionally, the product also utilizes Groove Plate technology, which further improves the cooling process by providing better air circulation to the component.
Conclusion
The ATS-06D-10-C1-R0 heat sink is an essential component used in various industries and applications. It is designed to improve performance and reliability of electronic components through efficient cooling. The working principle of ATS-06D-10-C1-R0 heat sink relies on a combination of surface area, air flow, and thermal insulation to dissipate the heat away from the component into the heat sink. This combined with the Groove Plate technology and high-pressure extrusion molding technology, makes the ATS-06D-10-C1-R0 heat sink a great solution for delivering maximum performance for a wide variety of applications.
The specific data is subject to PDF, and the above content is for reference