| Allicdata Part #: | ATS-06D-139-C1-R0-ND |
| Manufacturer Part#: |
ATS-06D-139-C1-R0 |
| Price: | $ 3.12 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X20MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06D-139-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.82933 |
| 30 +: | $ 2.75289 |
| 50 +: | $ 2.60001 |
| 100 +: | $ 2.44705 |
| 250 +: | $ 2.29408 |
| 500 +: | $ 2.21761 |
| 1000 +: | $ 1.98820 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.790" (20.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 9.03°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-06D-139-C1-R0 thermal heat sink is a device designed to transfer thermal energy away from vulnerable components into the environment. Heat sinks are commonly used in computers to cool components such as CPUs, GPUs, memory and chipsets. They are also found in electronics such as amplifiers, A/V receivers, power supplies and many other devices. Heat sinks come in a variety of shapes and sizes depending upon the application for which they are designed.
The ATS-06D-139-C1-R0 has a unique application field and working principle. It is designed to create a large surface area between it and the components for the transfer of heat away from it in order to keep it functioning properly. Heat sinks are usually metallic devices with long and thin “fins” or vanes that create a larger surface area to both absorb and dissipate heat energy, thus increasing cooling efficiency. The ATS-06D-139-C1-R0 has an irregular shape and its vanes are designed in order to create more surface area and more heat dissipating area.
The main way that the ATS-06D-139-C1-R0 dissipates heat is by using thermal resistance. In order to create a higher thermal resistance, the heat sink pulls heat away from components by convection. The ATS-06D-139-C1-R0 is able to do this with the help of the air that passes through its large vanes, thus creating a more effective dissipating area.
The ATS-06D-139-C1-R0 heat sink also uses natural air convection in order to transfer heat. Thermal resistance is an important aspect of heat transfer and the ATS-06D-139-C1-R0 makes use of this. The device takes advantage of the natural convection of air and its design to reach more effective cooling solutions. By increasing the size of the fins and vanes on the heat sink, this leads to a larger cooling area, thus decreasing the thermal resistance.
The ATS-06D-139-C1-R0 heat sink also uses thermal radiation in order to dissipate heat. Thermal radiation is a form of irradiation that occurs when heat is radiated through the air. This type of radiation is most effectively used in areas with little air movement, as in the atmosphere. This type of radiation is also known as black-body radiation and it is the most efficient form of heat dissipation.
In conclusion, the ATS-06D-139-C1-R0 thermal heat sink is a device that is designed to transfer thermal energy away from vulnerable components into the environment. It utilizes several methods to achieve its goal such as convection, thermal resistance and thermal radiation. By using these methods, the ATS-06D-139-C1-R0 is able to create an effective cooling solution for a wide variety of applications.
The specific data is subject to PDF, and the above content is for reference