ATS-06D-16-C1-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.126" (54.01mm)
Width:	2.126" (54.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	18.06°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction

Thermal heat sinks are components that are used to dissipate the heat generated by electronic components or devices. Thermal management is essential for any electronic device to remain operational. Without proper thermal management, electronic components will fail due to high temperature. The ATS-06D-16-C1-R0 is a thermal heat sink designed for cooling applications.

Features

The ATS- 06D-16-C1-R0 is a high-performance thermal heat sink that offers excellent performance characteristics. It is constructed from aluminum and features a large fin surface area designed to maximize heat transfer. The ATS-06D-16-C1-R0 features a unique fin design which reduces the pressure drop during operation, thus increasing the overall efficiency. Additionally, the ATS-06D-16-C1-R0 features an efficient heat dissipation characteristic across a broad temperature range.

Applications

The ATS-06D-16-C1-R0 is suitable for applications such as LED lighting, automotive electronics, HVAC, medical equipment, power amplifier modules, and consumer electronics. It is also ideal for applications that require a high degree of thermal efficiency and reliability. The ATS-06D-16-C1-R0 provides the necessary thermal management capability to ensure long-term reliability of any electronic device.

Working Principle

The ATS-06D-16-C1-R0 works on the principle of natural convection. This means that it relies on the natural circulation of air to dissipate heat generated by electronic components. The large surface area of the thermal heat sink facilitates the circulation of air and the efficient dissipation of heat. Heat generated by electronic components is transferred from the device into the aluminum heat sink, and then dissipated into the air.

Advantages

The ATS-06D-16-C1-R0 offers numerous advantages for cooling applications. It has excellent cooling efficiency and is highly reliable. The aluminum construction of the thermal heat sink ensures durability and long-term operation. The ATS-06D-16-C1-R0 is also lightweight and easy to install. Additionally, the fin design of the ATS-06D-16-C1-R0 reduces the pressure drop during operation, thus improving the overall efficiency of the heat sink.

Conclusion

The ATS-06D-16-C1-R0 is an excellent thermal heat sink that offers excellent performance characteristics. It is lightweight and easy to install, and has a unique fin design which increases efficient heat dissipation. The ATS-06D-16-C1-R0 is suitable for applications such as LED lighting, automotive electronics, HVAC, medical equipment, power amplifier modules, and consumer electronics. It provides the necessary thermal management capability to ensure long term reliability of any electronic device.

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