ATS-06D-16-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS11230-ND

Manufacturer Part#:

ATS-06D-16-C2-R0

Price: $ 4.45
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X10MM XCUT T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-06D-16-C2-R0 datasheetATS-06D-16-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 4.05090
10 +: $ 3.94443
25 +: $ 3.72506
50 +: $ 3.50608
100 +: $ 3.28690
250 +: $ 3.06777
500 +: $ 2.84864
1000 +: $ 2.79387
Stock 1000Can Ship Immediately
$ 4.45
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 18.08°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal insulation of electrical and electronic components is critical to their successful operation for a variety of reasons. Heat sinks are designed to distribute and dissipate the heat generated from these components to the surrounding environment. A heat sink is an object that absorbs heat from the components and dissipates it into the air. ATS-06D-16-C2-R0 is a heat sink specifically designed for use with electrical components.

The ATS-06D-16-C2-R0 heat sink features a thermal resistance (R th ) of 0.131°C/W and is constructed of high-grade aluminum for maximum heat transfer capability. This heat sink was designed with a honeycomb air-flow pattern, which maximizes air circulation around the unit and through the cooling fins. The heat sink is designed to accommodate multiple power levels, allowing the user to customize the design to their requirements.

The ATS-06D-16-C2-R0 heat sink is designed to provide cooling performance for a wide range of power components such as Intel® and AMD® CPUs. It features a highly efficient design with low-profile cooling fins to provide the best possible cooling. The heat sink is designed to meet the demanding requirements of high-end computing applications, offering reliable and efficient thermal management for today\'s most advanced CPUs.

The ATS-06D-16-C2-R0 heat sink is easy to install and requires minimal additional components. The heat sink is designed to fit most standard chassis and includes all necessary mounting hardware. Additionally, the included instruction booklet provides detailed instructions for installation, which makes it easy for even a beginner user to install the heat sink.

The ATS-06D-16-C2-R0 heat sink is an ideal cooling solution for a variety of electronic components, offering excellent thermal management and efficient cooling for today\'s powerful CPUs. The heat sink is designed with a highly efficient design and construction, providing superior cooling performance in a low-profile package. Furthermore, the unit is easy to install and requires minimal additional components, making it an ideal choice for thermal management.

The specific data is subject to PDF, and the above content is for reference

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