| Allicdata Part #: | ATS11241-ND |
| Manufacturer Part#: |
ATS-06D-17-C2-R0 |
| Price: | $ 4.56 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X12.7MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06D-17-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 4.13910 |
| 10 +: | $ 4.02507 |
| 25 +: | $ 3.80167 |
| 50 +: | $ 3.57802 |
| 100 +: | $ 3.35437 |
| 250 +: | $ 3.13075 |
| 500 +: | $ 2.90712 |
| 1000 +: | $ 2.85122 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 15.44°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important consideration in any type of electronic application. Heat sinks are one of the most common methods of cooling components in a wide variety of electrical and electronic products. Heat sinks work by transferring heat generated by electrical components away from their source, dissipating it into the surrounding environment. ATS-06D-17-C2-R0 is an excellent example of a thermal management heat sink.
ATS-06D-17-C2-R0 is a soldered heat sink with a high thermal conductivity for cooling electronic components in tight spaces. Its aluminum construction allows efficient heat transfer through conduction, while the pins at each end provide secure mounting. This particular heat sink is ideal for dissipating heat from discrete components such as voltage regulators, FETs, and other surface mounted devices. It is also suitable for high power applications, thanks to its ability to handle high-frequency switching power supplies.
The main advantage of the ATS-06D-17-C2-R0 is its small size. It measures just 16.5 x 19mm, making it an ideal choice for applications where space is at a premium. The small size of the heat sink also makes it suitable for mobile applications, such as handheld devices or laptop computers. As there is no need to increase the size of the device to accommodate a larger heat sink, this reduces the cost and complexity of the overall design.
The ATS-06D-17-C2-R0 does not require any additional accessories to install, such as a fan or other cooling system. It is designed to dissipate heat through direct contact with its surface, making it an efficient and cost-effective cooling solution. The aluminum construction of the heat sink ensures maximum heat dissipation, while the pins at each end provide secure mounting and stability for its small size.
Another great benefit of the ATS-06D-17-C2-R0 is its compatibility with a wide range of devices. Its small size makes it suitable for use in tight spaces, while its compatibility with a range of voltages and frequencies ensures it can be used in a variety of applications. Its ability to provide efficient cooling is also an asset when it comes to sophisticated designs where the dissipated heat has to be balanced with the needs of the device.
The ATS-06D-17-C2-R0 is an excellent example of a thermal management heat sink. Its small size and aluminum construction make it ideal for a range of applications, from mobile devices to high power switching power supplies. Its ability to dissipate heat through direct contact with its surface makes it an efficient and cost-effective cooling option, and its compatibility with a range of voltages and frequencies ensures it can be used in a variety of different applications.
The specific data is subject to PDF, and the above content is for reference