ATS-06D-181-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-06D-181-C1-R0-ND

Manufacturer Part#:

ATS-06D-181-C1-R0

Price: $ 3.45
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X10MM R-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-06D-181-C1-R0 datasheetATS-06D-181-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.13866
30 +: $ 3.05361
50 +: $ 2.88401
100 +: $ 2.71435
250 +: $ 2.54470
500 +: $ 2.45987
1000 +: $ 2.20541
Stock 1000Can Ship Immediately
$ 3.45
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.394" (10.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 11.93°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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ATS-06D-181-C1-R0 application field and working principle

ATS-06D-181-C1-R0 is a thermal-heat sink that is used to dissipate heat from an internally-heated component. It is designed to provide an efficient cooling solution for components such as LED lighting, power supply modules, electronic components, motors, and other devices with an internal heat source. Heat will always follow the path of least resistance, and the heat sink provides a physical barrier to impede this natural process. The larger the surface area of the heat sink, the more efficient it can be.

This device is designed to help evenly disperse heat away from the heated component by dissipating it into the immediate environment. Heat is transferred from the component to the heat sink fins through what is known as convection. Heat is then taken away from the fins by natural air movement and/or a cooling fan. Finned heat sinks are most effective when the fan is the source air movement, as the fins can become blocked by surrounding components or objects. A fan also provides the added benefit of pulling in fresh cool air to the component and pushing out the heated air.

One of the most important factors to consider when choosing a heat sink is the material it is made from. The material will determine how effective the heat sink is at dissipating heat from the component. Aluminum is a popular choice as it has high thermal conductivity and is lightweight, which makes it desirable for many applications. Copper is a more expensive, but better performing material, and is often used in high-power applications. When reviewing datasheets for a heat sink, the most important aspects to look out for are the thermal resistance and the overall thermal transfer rate.

In a nutshell, ATS-06D-181-C1-R0 is designed to provide effective and efficient cooling solutions for internally-heated components. The material of the heat sink and the fin arrangement are some of the most important aspects to consider. This device is also designed to transfer heat from the component to the environment by natural convection and air movement. The larger the surface area of the heat sink, the more efficient it will be.

The specific data is subject to PDF, and the above content is for reference

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