ATS-06D-21-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.362" (60.00mm)
Width:	2.362" (60.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.394" (10.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	16.33°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Thermal - Heat Sinks

Heat sinks are essential components in a wide range of electronic and electrical equipment. They provide thermal management that is often necessary to ensure the proper functioning of these devices. The ATS-06D-21-C3-R0 heat sink is one such component, which is designed to provide a cost-effective and high-performance solution to the thermal management needs of many devices.

Application Field

ATS-06D-21-C3-R0 heat sinks are most commonly used in a wide variety of applications, including:

• Electronic components
• Communication equipment
• Lighting systems
• Industrial automation systems
• Automotive electronics
• Security systems
• Power systems
• Consumer electronics

The common characteristics of these applications are that their devices must operate reliably under extreme conditions, such as high-temperature or high-humidity environments, and without the use of any active cooling systems. The ATS-06D-21-C3-R0 heat sink is an ideal solution in such cases, as it can provide the necessary cooling capacity with a relatively low-cost, reliable, and lightweight design.

Working Principle

ATS-06D-21-C3-R0 heat sinks work by dissipating the heat from a heat source, such as a processor or a power supply, to the environment through the process of convection. This process works by removing the heat from the object by drawing on the surrounding air. The heat sink contains a number of fins that act as a large area that can absorb and transfer the heat away from the object. The fins are usually made from aluminum or copper for their good thermal conductivity.The fins are arranged in a number of rows, with each row having its own group of fins. The overall system is also designed to maximize its size, so as to increase the surface area for better and more efficient heat dissipation. This is achieved by the use of a series of fins that are staggered in both horizontal and vertical directions. This arrangement allows for more air circulation around the fins, increasing the overall cooling performance of the heat sink.The heat sink also typically contains a series of protrusions that direct airflow, which is necessary for optimal heat dissipation. These protrusions are usually made of plastic, and they are designed to direct the airflow towards the fins to further increase its cooling performance.

Conclusion

The ATS-06D-21-C3-R0 heat sink is a popular choice for a wide range of electronic and electrical equipment for its reliable and efficient thermal management capabilities. The heat sink uses the process of convection to dissipate heat away from its heat source, and its design includes a number of fins that are arranged to maximize its surface area. Additionally, its design also includes a series of protrusions that are designed to channel airflow towards the fins to further improve its cooling performance.

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