ATS-06D-24-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.362" (60.00mm)
Width:	2.362" (60.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.790" (20.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	8.43°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction to Thermal-Heat Sinks

Thermal-heat sinks are one of the most popular cooling devices used in the engineering and industrial markets. They come in a variety of sizes and shapes and are designed to provide a reliable and efficient cooling for a wide range of components. With advances in cooling technology, many types of thermal-heat sinks have been developed. Each type has its own advantages and disadvantages.

ATS-06D-24-C3-R0 Thermal Heat Sink

The ATS-06D-24-C3-R0 thermal-heat sink is a top-of-the-line cooling device manufactured by Advanced Thermal Solutions (ATS). It is designed to provide superior cooling performance and optimal heat dissipation for a wide range of applications, and can work in harsh or confined environments. This thermal-heat sink also features an innovative fin design and an advanced heat sink base construction for enhanced heat transfer.

ATS-06D-24-C3-R0 Application Field

The ATS-06D-24-C3-R0 thermal-heat sink is particularly suitable for use in high-performance electronics and other applications that require superior cooling performance. It is particularly effective in providing cooling for high-performance CPUs, GPUs, AMD, and Intel CPUs, storage devices, and other high- specification components. It is also suitable for cooling air-conditioned spaces, such as automotive and transport vehicle cooling systems, and medical equipment.

ATS-06D-24-C3-R0 Working Principle

The ATS-06D-24-C3-R0 thermal-heat sink uses a single-stage heat-sink base and innovative fin design to deliver superior cooling performance. The fins are made from aluminum for optimal heat transfer. The heat sink base consists of two layers of material – an insulation layer to protect the components from the thermal-heat sink\'s heat and a copper layer to increase the surface area and speed up the cooling process. The fins are designed to maximize the surface area for efficient heat transfer. This is done by dispersing the heat so that the fin surface is continually exposed to the cooler external air. The base also features a unique airflow design with three fans that give it exceptional airflow for superior cooling. The fans keep the air moving and provide a constant and consistent flow of air over the fins, ensuring optimal cooling performance.

Conclusion

In summary, the ATS-06D-24-C3-R0 thermal-heat sink is a top-of-the-line cooling device designed to provide superior cooling performance and optimal heat dissipation for a wide range of applications. Its innovative design includes an advanced heat-sink base and innovative fin design for maximum surface area and speed up cooling. The ATS-06D-24-C3-R0 thermal-heat sink is suitable for use in high-performance electronics and other applications that require superior cooling performance.

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