| Allicdata Part #: | ATS-06D-28-C3-R0-ND |
| Manufacturer Part#: |
ATS-06D-28-C3-R0 |
| Price: | $ 7.48 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X15MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06D-28-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 6.73218 |
| 30 +: | $ 6.35796 |
| 50 +: | $ 5.98387 |
| 100 +: | $ 5.60990 |
| 250 +: | $ 5.23590 |
| 500 +: | $ 4.86191 |
| 1000 +: | $ 4.76841 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 10.62°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks: ATS-06D-28-C3-R0 Application Field and Working Principle
The ATS-06D-28-C3-R0 is a thermal - heat sink, a type of passive cooling device which uses airflow to transfer heat away from its source. It is a relatively small device, measuring 37mm in height, 28mm in width, and 17mm in thickness, making it well-suited for use in a variety of applications. The ATS-06D-28-C3-R0 is often used in computers, servers, and other electronics needing effective thermal management. In addition, it can be used for other industrial applications, such as optical and superconducting materials.
The ATS-06D-28-C3-R0 functions using the principles of heat transfer and convection. Heat transfer, the process of energy transfer between objects, takes place when the temperature of one object is higher than the temperature of its surroundings. The ATS-06D-28-C3-R0 works by dispersing heat away from its source. This can be done by either thermal conduction or convection. Thermal conduction is the transfer of heat through physical contact between solid objects. Convection, on the other hand, is the transfer of heat through liquid or gas, via the movement of molecules.
In the case of the ATS-06D-28-C3-R0, thermal conduction and convection both occur simultaneously, allowing for an effective heat transfer. Heat is removed from its source by the heat sink, and then dissipated into the surrounding environment. The ATS-06D-28-C3-R0 has a large surface area, allowing for maximum thermal contact. This means that more heat can be transferred away from its source, making it an efficient cooling device.
The ATS-06D-28-C3-R0 contains a base plate which is constructed from aluminum. This base plate is then connected to a heatsink, which is made from extruded aluminum fins. These fins are designed to maximize the surface area, allowing for greater heat dissipation. The heat is then dissipated into the surrounding environment. Finally, air is drawn in from the top of the heatsink, allowing for a continual circulation of air to further improve the efficiency of the ATS-06D-28-C3-R0.
The ATS-06D-28-C3-R0 is a highly effective thermal management device, making it a great choice for use in a variety of applications. It is able to effectively dissipate heat away from its source, providing an efficient cooling solution. In addition, its small size allows for easy installation and maintenance. The ATS-06D-28-C3-R0 is a great choice for anyone in need of an effective thermal management device.
The specific data is subject to PDF, and the above content is for reference