ATS-06D-37-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-06D-37-C1-R0-ND

Manufacturer Part#:

ATS-06D-37-C1-R0

Price: $ 5.43
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 36.83X57.6X17.78MM
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-06D-37-C1-R0 datasheetATS-06D-37-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.88124
30 +: $ 4.60992
50 +: $ 4.33881
100 +: $ 4.06766
250 +: $ 3.79648
500 +: $ 3.52531
1000 +: $ 3.45751
Stock 1000Can Ship Immediately
$ 5.43
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Rectangular, Fins
Length: 1.450" (36.83mm)
Width: 2.267" (57.60mm)
Diameter: --
Height Off Base (Height of Fin): 0.700" (17.78mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.10°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management technologies are essential for data centers and other electronic applications. Heat sinks are one of the most commonly used thermal management technologies, as they are efficient, reliable, and cost-effective. The ATS-06D-37-C1-R0 is a type of heat sink that is used in many different industries for effective thermal management. The following discussion details the application field and working principle of the ATS-06D-37-C1-R0.

Application Field of the ATS-06D-37-C1-R0

The ATS-06D-37-C1-R0 is a series of aluminum heat sinks from ATS. It is designed to dissipate heat from data centers, servers, computers, telecommunication cabinets, and other types of electronic equipment. The heat sink is designed to work with a broad range of thermal components, such as CPU, memory, power supplies, voltage regulators, fans, and thermistors. The heat sink is also compatible with a wide variety of cooling systems, such as air cooling, water cooling, and other systems. In addition, the heat sink is easy to install and is available in a variety of sizes.

Working Principle of the ATS-06D-37-C1-R0

The ATS-06D-37-C1-R0 uses the natural process of convection to help dissipate heat from electronic equipment. Convection is the transfer of heat through air or liquid as a result of differences in temperature. The heat sink is designed to transfer heat from higher-temperature components to lower-temperature components through the use of fins. Fins are thin protrusions that are spread out across the surface of the heat sink to maximize surface area. The surface area of the fins increases the surface area exposed to air and increases conduction of heat from the higher-temperature components to the cooler air around it.

The ATS-06D-37-C1-R0 also uses thermal inductors. Thermal inductors are designed to transfer heat from one component to another by taking advantage of the thermal properties of the material. Thermal inductors are made of various materials, such as aluminum, copper, thermoplastics, and glass-filled polymers. The material used in the thermal inductors allows them to conduct heat more quickly than air or liquid to increase the overall efficiency of the heat sink.

In addition, the ATS-06D-37-C1-R0 utilizes a fan to further help dissipate heat. The fan\'s blades move air to help draw in cooler air, which increases the rate of convection. The fan also helps to reduce the noise levels, as it keeps the heat sink from getting too hot, maintaining a lower operating temperature.

The ATS-06D-37-C1-R0 is a reliable, efficient, and cost-effective heat sink, making it an ideal choice for data centers and other electronic applications. With its combination of convection, fins, thermal inductors, and fan, the ATS-06D-37-C1-R0 effectively dissipates heat from higher-temperature components to lower-temperature components and helps keep equipment running at optimal levels.

The specific data is subject to PDF, and the above content is for reference

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