ATS-06D-64-C1-R0 Allicdata Electronics
Allicdata Part #:

ATS-06D-64-C1-R0-ND

Manufacturer Part#:

ATS-06D-64-C1-R0

Price: $ 3.77
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X25MM L-TAB
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-06D-64-C1-R0 datasheetATS-06D-64-C1-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.42405
30 +: $ 3.23358
50 +: $ 3.04340
100 +: $ 2.85314
250 +: $ 2.66293
500 +: $ 2.47272
1000 +: $ 2.42517
Stock 1000Can Ship Immediately
$ 3.77
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 9.36°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks

A heat sink is a thermally conductive object that is designed to absorb, dissipate and regulate the temperature of another heat-generating object. The ATS-06D-64-C1-R0 (also known as the "64C") is a high-performance heat sink that utilizes advanced ceramic technology to enable efficient heat dissipation.

The 64C is made of a ceramic material that is highly efficient in heat conduction and has a remarkably low thermal expansion coefficient. This property is especially critical in high-performance thermal management applications, as it keeps the heat sink tightly installed and allows optimal heat transfer from the object to the heat sink.

The 64C has a unique stacked-fin design which minimizes air resistance, allowing more efficient airflow and promoting optimal heat dissipation efficiency. The heat sink also features low thermal resistance due to its finned design and its highly conductive ceramic material, which allows for maximum heat transfer away from the heat source.

The 64C is an ideal choice for high-performance, high-temperature applications such as electronics cooling, industrial equipment cooling, and automotive engine cooling. It is also suitable for applications where the thermal management system has limited space, such as laptops and other consumer electronic devices. The 64C has been tested to operate over a wide range of temperatures, making it a versatile and reliable cooling solution.

The 64C is easy to install and requires minimal maintenance. The heat sink includes mounting hardware that can be quickly and easily installed in most applications. The 64C is also lightweight and can be easily moved, allowing for maximum flexibility in its placement.

The 64C is an ideal solution for applications that require high-performance, efficient cooling. Its advanced ceramic technology allows for efficient heat dissipation, making it an ideal choice for high temperature and high-performance applications. Its low thermal resistance and low thermal expansion coefficient make it a reliable and durable solution for a variety of applications, and its easy installation and minimum maintenance requirements make it a versatile and reliable choice.

The specific data is subject to PDF, and the above content is for reference

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