ATS-06D-70-C1-R0

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management has become an increasingly significant consideration in the design of high-performance electronic equipment, as increased power dissipation, component packing density, and smaller form factor requirements place heavier requirements on the thermal management solutions for such systems. The ATS-06D-70-C1-R0 is a thermal management heat sink designed to meet the needs of device packages that require high thermal performance in limited space.

The ATS-06D-70-C1-R0 features a unique fin profile and is optimized for use with light-weight and portable thermal cooling systems. This thermal heat sink is comprised of a finned aluminum body with a top end cap that holds the integrated heat-spreading element. The package features an aluminum construction with a 0.68mm face, offering high thermal conductivity and resistance to corrosion and oxidation.

The ATS-06D-70-C1-R0 heat sink is designed to provide excellent thermal performance in applications requiring the dissipation of 70W of power or less. The integrated heat spreader allows for maximum heat dissipation while providing superior service life due to its superior thermal performance. The finned aluminum allows for effective convection cooling, further increasing the thermal performance of the package.

The thermal performance of the ATS-06D-70-C1-R0 is governed by its thermally optimized fin design. The fin profile is designed to provide optimal airflow and thermal performance, allowing for the most efficient transfer of heat from the device to the exterior environment. The fin material is also optimized for high thermal conductivity, allowing for more effective heat transfer and cooling.

The application field of the ATS-06D-70-C1-R0 thermal heat sink is mainly in the areas of server-level systems, workstations, mobile devices, and other electronic devices requiring high thermal performance in a compact package. The heat sink is also suitable for consumer and embedded system applications.

In general, the working principle of the ATS-06D-70-C1-R0 thermal heat sink is to draw heat away from the device and dissipate it into the ambient environment through convection cooling. The thermal heat sink features integrated fins which increase the surface area exposed to the airflow and increase the rate of convection cooling. The fins are also optimized for thermal performance, allowing the heat to be dissipated quickly and efficiently.

In conclusion, the ATS-06D-70-C1-R0 thermal heat sink offers superior thermal performance in small form factors, making it an ideal solution for high-performance electronic devices that require advanced thermal management solutions. The fin design and construction allow for maximum thermal conductivity, enabling more efficient heat transfer and dissipation. By leveraging the thermal optimization of the ATS-06D-70-C1-R0, designers can maximize thermal management in their designs while ensuring optimal long-term performance.

The specific data is subject to PDF, and the above content is for reference