| Allicdata Part #: | ATS11362-ND |
| Manufacturer Part#: |
ATS-06E-10-C2-R0 |
| Price: | $ 4.19 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X25MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06E-10-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.80520 |
| 10 +: | $ 3.70125 |
| 25 +: | $ 3.49574 |
| 50 +: | $ 3.29011 |
| 100 +: | $ 3.08448 |
| 250 +: | $ 2.87885 |
| 500 +: | $ 2.67322 |
| 1000 +: | $ 2.62181 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.89°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management has long been a key area of concern in the development of electronic components. Heat is a frequent source of malfunction and can lead to the failure of sensitive equipment. Heat sinks are used to transfer heat away from components and provide increased temperature stability. Thermal materials like thermal compounds or greases are applied to increase contact between two surfaces and spread heat evenly from one surface to the other. The ATS-06E-10-C2-R0 heat sink is a robust design that is a reliable solution for managing heat in demanding applications.
The ATS-06E-10-C2-R0 heat sink is an independent device that requires no special control or power supply. The construction of the heat sink is designed to efficiently dissipate heat away from components. The heat sink has a rounded aluminum base and a series of interspaced fins. The fins of the heat sink are constructed from a highly efficient thermal material that is designed to spread heat evenly away from the components. The fins are arranged around a central cavity, which is filled with a thermal compound that serves to further enhance the heat transfer. The thermal material also helps to reduce heat build-up on the surface of the device.
The ATS-06E-10-C2-R0 heat sink is designed for use in a wide variety of applications. It is suitable for controlling heat in industrial components, consumer electronics, and telecommunications equipment. The device can be used to cool CPUs, GPUs, and other semiconductor devices. The heat sink is also designed to be compatible with various thermal solutions such as air or liquid coolers and fans. Additionally, the device can be used to control the temperature of both active and passive components.
The ATS-06E-10-C2-R0 heat sink is effective in transferring heat away from components due to its well-designed construction. The rounded base of the device is designed to make contact with a variety of surfaces. The thermal material in the fins is highly efficient in spreading heat from the surface of the components to the external environment. The thermal compound in the central cavity enhances the heat transfer from the fins to the environment. Additionally, the device is designed to be compatible with various cooling solutions, which further helps to control the temperature of components.
The ATS-06E-10-C2-R0 heat sink is a reliable solution for managing heat in demanding applications. The device is designed with an efficient construction and compatible with various thermal solutions. The device is suitable for controlling heat in industrial components, consumer electronics, and telecommunications equipment. The ATS-06E-10-C2-R0 heat sink is an effective solution for transferring heat away from components and providing increased temperature stability.
The specific data is subject to PDF, and the above content is for reference