ATS-06E-10-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-06E-10-C3-R0-ND

Manufacturer Part#:

ATS-06E-10-C3-R0

Price: $ 3.93
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 45X45X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-06E-10-C3-R0 datasheetATS-06E-10-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.57399
30 +: $ 3.37554
50 +: $ 3.17696
100 +: $ 2.97845
250 +: $ 2.77989
500 +: $ 2.58133
1000 +: $ 2.53168
Stock 1000Can Ship Immediately
$ 3.93
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.772" (45.00mm)
Width: 1.772" (45.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.99°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal - Heat Sinks are designed to keep electronic components cool and are essential when operating any type of device, including ATS-06E-10-C3-R0. In this article, the application fields and working principles of ATS-06E-10-C3-R0 will be explained.

First and foremost, the ATS-06E-10-C3-R0 was designed for use in applications such as power electronics, automotive control units, laser diodes, and high-end CPUs. Furthermore, its main purpose is to dissipate heat away from components and ensure they remain operational at their desired temperature levels.

The working principle of this heat sink is based on a combination of convection and conduction. As components generate heat, the ATS-06E-10-C3-R0 uses the convection process to move the hot air away from them, while conduction draws the heat away from the components and into the fins of the heat sink. This process of convection and conduction then continues in a cyclical pattern, allowing for sustained cooling performance of the electronic components.

To further improve the performance of the ATS-06E-10-C3-R0, additional cooling methods, such as forced-air cooling and liquid cooling loops, may be employed. Forced-air cooling uses fans to actively push air through the heat sink fins, further increasing the efficiency of the convection process. Liquid cooling utilizes a liquid circulation system to dissipate more heat away from the components. However, in order to fully utilize these additional cooling methods, the ATS-06E-10-C3-R0 must be properly fitted with the appropriate components.

Overall, with its combination of convection and conduction along with additional cooling options, the ATS-06E-10-C3-R0 is an ideal choice for keeping electronic components cool. It is well suited for numerous applications, such as power electronics, automotive control units, laser diodes, and high-end CPUs. Furthermore, its combination of affordability and performance make it an ideal addition to any cooling system or electronic device.

The specific data is subject to PDF, and the above content is for reference

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