| Allicdata Part #: | ATS11374-ND |
| Manufacturer Part#: |
ATS-06E-110-C2-R1 |
| Price: | $ 5.59 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X40X12.7MM XCUT T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06E-110-C2-R1 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 5.07780 |
| 10 +: | $ 4.93920 |
| 25 +: | $ 4.66452 |
| 50 +: | $ 4.39022 |
| 100 +: | $ 4.11585 |
| 250 +: | $ 3.84146 |
| 500 +: | $ 3.56707 |
| 1000 +: | $ 3.49848 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Rectangular, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.500" (12.70mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 26.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us: sales@allicdata.com
Thermal - Heat Sinks play an important role in protecting components from the damaging effects of heat. Many methods of cooling are available, from natural convection cooling to air cooled heat sinks. The ATS-06E-110-C2-R1 heat sink is a product designed for the purpose of dissipation of large amounts of heat.
Application Field
The ATS-06E-110-C2-R1 is designed to cool high-power semiconductor devices, such as transistors, chip resistors, and other heat-generating components. It is a compact device that can be easily mounted to a PCB, and its small size makes it suitable for applications with limited space requirements. The ATS-06E-110-C2-R1 is often used in computers, lasers, LED lighting, medical imaging equipment, and other digital and analog equipment.
Working Principle
The ATS-06E-110-C2-R1 operates on the principle of natural convection cooling, which relies on the natural movements of air caused by temperature differences. Hot air rises due to the higher temperature, and cool air sinks due to the lower temperature. This creates a cyclical movement of air, resulting in increased dissipation of the heat generated by the device. The ATS-06E-110-C2-R1 utilizes this natural convection process to effectively dissipate large amounts of heat.
The ATS-06E-110-C2-R1 is composed of a series of aluminum fins that increase the surface area available for the dissipation of heat. These fins are arranged in such a way that a large amount of air is circulated across the fins, which helps to cool the components by dissipating the heat more quickly and efficiently. The aluminum fins also provide conductive pathways for the heat, which allows for more heat to be dissipated from the device. The ATS-06E-110-C2-R1 also features an integrated heat sink plate that further increases the efficiency of heat dissipation.
The ATS-06E-110-C2-R1 is an ideal choice for applications that require large amounts of heat dissipation in tight spaces. Its compact size and efficient cooling capabilities make it ideal for a wide range of applications, from computers to medical imaging equipment. The ATS-06E-110-C2-R1 is a reliable solution for dissipating heat from high-power semiconductor devices.
The specific data is subject to PDF, and the above content is for reference