| Allicdata Part #: | ATS-06E-116-C3-R0-ND |
| Manufacturer Part#: |
ATS-06E-116-C3-R0 |
| Price: | $ 3.60 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 40X40X25MM XCUT T412 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06E-116-C3-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.26907 |
| 30 +: | $ 3.18087 |
| 50 +: | $ 3.00422 |
| 100 +: | $ 2.82744 |
| 250 +: | $ 2.65074 |
| 500 +: | $ 2.56237 |
| 1000 +: | $ 2.29730 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.575" (40.00mm) |
| Width: | 1.575" (40.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 4.26°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal management is an important factor for the proper functioning of electronic devices, which must be able to dissipate heat from the components in order to perform properly and protect component health. Heat sink technology is designed to safely and efficiently dissipate heat from the components. The ATS-06E-116-C3-R0 is designed as a Heat Sink to help reduce the operating temperature of a device, allowing it to last longer and work better.
The ATS-06E-116-C3-R0 is a type of Heat Sink product designed to dissipate heat by the use of a fan mounted on the device, a separate air moving device that cools the component by pumping air over the sink, or a combination of both. Heat Sinks are employed as a way to move heat away from sensitive components, reducing the temperature of the component and increasing its lifespan. This technology also prevents the occurrence of electrical overload and enables the device to operate efficiently.
The cooling mechanism of the ATS-06E-116-C3-R0 Heat Sink works by pumping air over a designated area of the component, cooling it down. This is done through the use of a fan that is mounted on the device, which helps to dissipate generated heat and keeps the component from overheating. The air moves over the designated component area, transferring its heat away from the device and into the environment. In addition, the Heat Sink also contains a heat conductive material, such as copper or aluminum, which helps to further dissipate the hot air surrounding the device.
The ATS-06E-116-C3-R0 Heat Sink is typically used in the field of telecommunications or in industrial applications. It is capable of providing effective thermal transfer for electronic components, including CPUs, GPUs, transistors and circuits. The Heat Sink is also ideal for use in a variety of consumer electronics, such as HDTV, satellite receivers and mobile phones. The high performance and efficiency of the ATS-06E-116-C3-R0 Heat Sink makes it a prime choice for these applications, as it is able to provide reliable cooling with a minimal amount of noise or vibration. It is also capable of dissipating heat from components with a minimum amount of energy, making it an economical option.
The ATS-06E-116-C3-R0 Heat Sink is a great choice for anyone looking to improve the thermal management of their electronics devices. Its efficient performance and quiet operation make it an ideal cooling solution for a variety of applications. Its ability to dissipate heat from components also enables longer lifespans of sensitive components and ensures the efficient and safe operation of any electronic device.
The specific data is subject to PDF, and the above content is for reference