ATS-06E-156-C2-R0 Allicdata Electronics
Allicdata Part #:

ATS11424-ND

Manufacturer Part#:

ATS-06E-156-C2-R0

Price: $ 4.44
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X25MM L-TAB T766
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-06E-156-C2-R0 datasheetATS-06E-156-C2-R0 Datasheet/PDF
Quantity: 1000
1 +: $ 4.03200
10 +: $ 3.92112
25 +: $ 3.70339
50 +: $ 3.48541
100 +: $ 3.26762
250 +: $ 3.04978
500 +: $ 2.83194
1000 +: $ 2.77748
Stock 1000Can Ship Immediately
$ 4.44
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 4.14°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

The ATS-06E-156-C2-R0 is a type of thermal solution composed of a heat sink and engineered solution. The thermal solution was designed specifically for use in industrial and commercial settings, and provides great thermal management in environments with a variety of heat sources and cooling requirements. This thermal solution can provide superior performance for a wide range of operating conditions.

The ATS-06E-156-C2-R0 was developed to address the increasingly demanding requirements for high performance, low power consumption, and system integration in industrial and commercial applications. This thermal solution utilizes advanced semi-conductor and heat dissipation technology, combined with a proprietary design. The ATS-06E-156-C2-R0 works by drawing heat drawn away from sensitive semiconductors and other electrically-sensitive components via thermal conduction, and away from the system through its heat sink made of copper, aluminium or other material.

The ATS-06E-156-C2-R0 has a unique cooling mechanism which utilizes thermodynamic principles to ensure maximum system performance and thermal efficiency. The thermodynamic mechanism helps to facilitate efficient heat transfer and diffusion. It involves a two-stage process, where in the first stage, heat is pulled away from the component by using an aluminum fin. The second stage involves the thermal conduction and diffusion of the heat from the aluminum fin into the air. It is important to note that this solution is designed to work best at lower temperatures, and that users should monitor system temperatures for optimal performance.

The ATS-06E-156-C2-R0 offers a number of advantages which include improved energy efficiency, improved performance, improved protection against power surges, improved air flow, noise suppression, and a rotatable and compliant clamping system. This thermal solution can also help to prevent overheating of components, providing greater system reliability. The ATS-06E-156-C2-R0 also features a high impact design, with effective cooling and adjustable screws so the solution can be tailored to specific application needs.

In summary, the ATS-06E-156-C2-R0 is a type of thermal solution designed for use in industrial and commercial settings. The system uses advanced semi-conductor and heat dissipation technology combined with a proprietary design to provide superior thermal management. The solution also provides a number of advantages such as improved energy efficiency, improved performance, improved protection against power surges, improved air flow, noise suppression, and a rotatable and compliant clamping system. The ATS-06E-156-C2-R0 is a great solution for those looking for an efficient and reliable way to cool.

The specific data is subject to PDF, and the above content is for reference

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