| Allicdata Part #: | ATS-06E-160-C1-R0-ND |
| Manufacturer Part#: |
ATS-06E-160-C1-R0 |
| Price: | $ 3.66 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 45X45X15MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06E-160-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.32892 |
| 30 +: | $ 3.23862 |
| 50 +: | $ 3.05878 |
| 100 +: | $ 2.87885 |
| 250 +: | $ 2.69892 |
| 500 +: | $ 2.60896 |
| 1000 +: | $ 2.33906 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.772" (45.00mm) |
| Width: | 1.772" (45.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 6.65°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal heat sinks are vital components for any electronic device. ATS-06E-160-C1-R0 is a kind of advanced thermal heat sink specifically designed for high-end and thin electronic devices like tablets, laptops, and other portable devices. It utilizes a combination of patented technologies to ensure optimal heat dissipation.
The ATS-06E-160-C1-R0 is a high-performance thermal heat sink designed with a combination of air-extracting fins, CNC-machined aluminum, and an advanced vapor chamber that helps to dissipate heat quickly from the interior of the device. The combined technologies reduce the heat generated by the device while increasing the overall efficiency of the device\'s cooling system.
The heat sink\'s design also offers a range of flexibility in terms of installation. The fins are organized in a way that creates additional airflow to improve the efficiency of the cooling process. The combination of the air-extracting fins and the aluminum material increases the heat dissipation rate. Additionally, the vapor chamber is designed to transfer the heat from the interior of the device without having to use additional fans.
In terms of its application field, the ATS-06E-160-C1-R0 is primarily used for cooling down electronic devices with a high workload. The thermal heat sink features a high thermal resistance coefficient, meaning that it has the capability to efficiently manage thermal energy more precisely and quickly. Its increased cooling efficiency also helps to lower the device\'s overall power consumption.
The ATS-06E-160-C1-R0 is also used to ensure that components remain within their optimal temperature range, throughout their lifetime. The device\'s design allows for efficient heat dissipation, even when the electronic device is under high load and multiple processes are running. The heat sink also has an increased life span, with its ability to efficiently manage thermal energy even when the device is under long term usage.
The ATS-06E-160-C1-R0\'s overall working principle is simple yet effective. The combination of air-extracting fins, CNC-machined aluminum and advanced vapor chamber helps to dissipate heat from the interior of the device quickly and prevent it from building up. This helps the device\'s cooling system to be more effective, and allows for a longer life span for the device. The heat sink is designed to ensure optimal heat dissipation, while maintaining a low power consumption.
Overall, the ATS-06E-160-C1-R0 is an advanced thermal heat sink designed to effectively dissipate heat generated by high-end electronic devices. Its design offers a range of flexibility in terms of installation, and its overall working principle is simple yet effective. It is an excellent choice for cooling down devices that are prone to excess heat accumulation.
The specific data is subject to PDF, and the above content is for reference