| Allicdata Part #: | ATS11435-ND |
| Manufacturer Part#: |
ATS-06E-166-C2-R0 |
| Price: | $ 3.40 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 25X25X15MM R-TAB T766 |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06E-166-C2-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 1 +: | $ 3.08700 |
| 10 +: | $ 3.00762 |
| 25 +: | $ 2.92648 |
| 50 +: | $ 2.76381 |
| 100 +: | $ 2.60127 |
| 250 +: | $ 2.43868 |
| 500 +: | $ 2.35738 |
| 1000 +: | $ 2.11351 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 0.984" (25.00mm) |
| Width: | 0.984" (25.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 12.18°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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The ATS-06E-166-C2-R0 thermal heat sink is a type of device used to regulate the temperature of electronic components. This is done by dissipating the heat generated by the component through its use of air or liquid coolants. The device is made of aluminum and is designed to dissipate heat from the component quickly and efficiently. It is used in a variety of applications and the working principles used in it are based on the principles of thermodynamics.
A heat sink is an active device that is used to manage heat dissipation from components. It absorbs and transfers heat away from the component and releases it into the surrounding environment. Heat sinks can be designed with and without fins, and the choice of which particular design is used depends on the application. While fins help increase the convective air flow that cools the component, designs without fins allow for a more compact design.
The ATS-06E-166-C2-R0 thermal heat sink is designed with several features to aid in its performance. Its aluminum frame is designed to be lightweight and has fins to improve convection cooling. The design also includes a fan to generate additional airflow, and a special housing allows for the proper routing of the fan’s coolant. A self-adhesive material helps secure it to the component.
The working principle of the ATS-06E-166-C2-R0 heat sink is based on thermodynamics, which states that heat flows from higher temperatures to lower temperatures. When the component generates heat, it is dissipated by the sink and is released into the external environment. The amount of heat released is determined by the design and size of the heat sink.
This device is commonly used in consumer electronics applications, such as computers, tablets, and smart phones. It is also used in industrial applications, such as telecommunications, HVAC systems, and power electronics. Heat sinks are an important part of operations for these industries as they help prevent the components from overheating due to excess heat.
In conclusion, the ATS-06E-166-C2-R0 thermal heat sink is a type of device used to regulate the temperature of electronic components. It is made of lightweight aluminum and includes fins to act as cooling enhancers. A fan is included to generate additional airflow, and a self-adhesive material helps secure it to the component. By dissipating the heat generated by the component, it can operate within the manufacturer’s specified temperature range. The device is used in a variety of applications due to its ability to effectively manage heat dissipation.
The specific data is subject to PDF, and the above content is for reference