| Allicdata Part #: | ATS-06E-18-C1-R0-ND |
| Manufacturer Part#: |
ATS-06E-18-C1-R0 |
| Price: | $ 3.75 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X15MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06E-18-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.41208 |
| 30 +: | $ 3.31968 |
| 50 +: | $ 3.13526 |
| 100 +: | $ 2.95079 |
| 250 +: | $ 2.76641 |
| 500 +: | $ 2.67419 |
| 1000 +: | $ 2.39754 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 13.37°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sinks are used to absorb and dissipate heat from electronic components, moreover, ATS-06E-18-C1-R0 is a type of thermal-heat sink. It is designed to absorb and dissipate the heat generated by high power electronic components.
ATS-06E-18-C1-R0 thermal-heat sink has a solid aluminum body with an extruded heatsink and a copper plate on the bottom. It has a high thermal conductivity of over 8W/m-K. It also has a built-in thermal sensor for temperature monitoring.
The dimensions of ATS-06E-18-C1-R0 are 18 inch in length, 6 inch in width and 6.5 inch in height. The fin height is 28mm. It has a thermal resistance of 0.33°C/W and is rated for a maximum cooling capacity of 150 W. The fan used with this heat sink should have a maximum speed of 2800 RPM.
This thermal-heat sink has a wide range of applications. It can be used for cooling components such as CPUs, GPUs, FPGAs, LEDs and power transistors. It is also suitable for cooling of high power switching components.
To ensure proper cooling of components, ATS-06E-18-C1-R0 uses a combination of conduction and convection cooling. Heat is conducted away from the components to the metal body of the sink and is further dissipated by the fins which increase the surface area.
The air flow is also increased by the fan and this heat is dissipated by convection. The fan connected to this thermal-heat sink causes a vacuum effect in the gap between the fins and the fin surface increases the air flow. This also helps in cooling the components even more.
To increase performance and longevity, it is important to mount the heat sink properly, secure it properly and use a thermal paste to ensure that there are no air gaps which can reduce the cooling effect.
In conclusion, ATS-06E-18-C1-R0 is a type of thermal-heat sink which can be used for cooling of high power electronic components such as CPUs, GPUs, FPGAs, LEDs and power transistors. It has a high thermal conductivity of 8W/m-K and a maximum cooling capacity of 150W. Proper mounting and use of thermal paste is recommended for optimal performance and longevity.
The specific data is subject to PDF, and the above content is for reference