ATS-06E-195-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-06E-195-C3-R0-ND

Manufacturer Part#:

ATS-06E-195-C3-R0

Price: $ 3.42
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 40X40X12MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-06E-195-C3-R0 datasheetATS-06E-195-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 3.10275
30 +: $ 3.01896
50 +: $ 2.85125
100 +: $ 2.68349
250 +: $ 2.51579
500 +: $ 2.43193
1000 +: $ 2.18034
Stock 1000Can Ship Immediately
$ 3.42
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 1.575" (40.00mm)
Width: 1.575" (40.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.472" (12.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 11.12°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

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The ATS-06E-195-C3-R0 is an electronic device designed for use in thermal heat sinks, specifically for regulating temperature. It is a semiconductor device, roughly the size of a fingernail, used to control and maintain the temperature of a system by transferring heat from one part of the system to another. It can either transfer heat by convection or conduction, depending on the application. It is commonly found in desktop computers, laptops, and other personal electronics as well as in industrial and manufacturing equipment.

The ATS-06E-195-C3-R0 uses a technology called thermal resistance, which is the resistance of a material to a change in temperature. Heat is generated within electronic components and the ATS-06E-195-C3-R0 acts as a thermal bridge to transfer this heat away from the system. The device is made up of several layers of materials which act as resistance to the transfer of heat energy. These layers of material are a combination of metals, ceramics, and thermally conductive substances. The use of these materials increases the thermal resistance, which in turn helps to transfer heat away from hot spots in the system.

The ATS-06E-195-C3-R0 is highly efficient and can be used in a variety of thermal applications. It is most commonly used in CPU cooling solutions, as well as in high power and industrial applications. It is also ideal for applications which require fast response times, such as temperature control systems and automotive applications. In addition to its thermal performance, it also has very low electrical resistance, making it suitable for a variety of uses.

The ATS-06E-195-C3-R0 can be used in many different ways. It can be used as a direct thermal transfer device, where it acts as a bridge between two components, transferring the heat from one component to the other. It can also be used as part of a larger cooling solution, used to transfer heat from one area of the system to another, distributing heat more evenly. Its low resistance also makes it useful in heat storage applications, where it can be used to store excess heat, reducing the temperature of other components in the system.

The ATS-06E-195-C3-R0 has proven to be a reliable and efficient device for temperature control and thermal transfer in a variety of applications. Its small size and low resistance allow it to be used in a variety of enclosures and applications, making it a versatile and cost-effective solution for thermal management. With its ability to effectively transfer heat from one component to another, the ATS-06E-195-C3-R0 is an ideal choice for temperature regulation and thermal transfer in a wide range of applications.

The specific data is subject to PDF, and the above content is for reference

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