| Allicdata Part #: | ATS-06E-20-C1-R0-ND |
| Manufacturer Part#: |
ATS-06E-20-C1-R0 |
| Price: | $ 3.99 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 54X54X25MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06E-20-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 3.62061 |
| 30 +: | $ 3.41922 |
| 50 +: | $ 3.21817 |
| 100 +: | $ 3.01701 |
| 250 +: | $ 2.81588 |
| 500 +: | $ 2.61474 |
| 1000 +: | $ 2.56446 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.126" (54.01mm) |
| Width: | 2.126" (54.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.984" (25.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 7.13°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Since the technical advancement has been rising day-by-day, thermal management technology has been applied mostly in the industrial, commercial, and consumer applications. Thermal management technology is used to maintain the optimal temperature of a device’s electronics using thermal heat sinks. In this article, we shall discuss a thermal-heat sink model – ATS-06E-20-C1-R0 and its application field and working principle.
Thermal Heat Sink
Thermal heat sinks are passive heat exchangers that absorb or dissipate heat from the surface areas of its components. They are commonly used to improve system performance, reduce power losses, reduce component temperatures, and increase equipment life. Heat sinks are available in various shapes and sizes to meet specific thermal requirements of different application fields.
ATS-06E-20-C1-R0 Thermal Heat Sink
The ATS-06E-20-C1-R0 Thermal Heat Sink is a flat rectangular thermal-heat sink made from ordinary aluminum alloy. It has a mounting hole length of 6mm, thickness of 20mm, a fin design with 3 fins per inch and a spacing factor of 0.5. It can be used in many applications such as in 1U rack mount servers, as well as for cooling of high power electronics. It is suitable for use with 45W or lower heat rating and can handle maximum airflow of up to 100 CFM.
Application Field
The ATS-06E-20-C1-R0 thermal-heat sink is suitable for a wide variety of applications. It is commonly used in computers and other electronic devices such as Laser cutting machines and 3D Printers. Other than that, it can be used in medical applications such as in X-ray generating machines, high power audio components and robotics. Similarly, it is suitable in home appliances and various automotive applications as well.
Working Principle
The working or the heat transfer principle of the ATS-06E-20-C1-R0 Thermal Heat Sink is quite simple and involves two processes- convection and radiation. The heat generated by the electronic components which is applied to the surface of the heatsink is absorbed by aluminum fins through convection process. Subsequently, the absorbed thermal energy is emitted away from the heatsink through radiation process.
To maximize the cooling effect, the ATS-06E-20-C1-R0 thermal-heat sink is equipped with fins, which increase its surface area to provide maximum heat transfer. The wider spacing between the fins allows increased airflow and heat transfer. The thermal energy absorbed by the aluminum fins is transferred to the airflow as it passes over them, thus reducing the overall temperature of the device.
Conclusion
In conclusion, the ATS-06E-20-C1-R0 thermal-heat sink is highly effective in dissipating the thermal energy from the electronic components of various devices. It works on two simple principles of convection and radiation, and has a mounting hole length of 6mm, thickness of 20mm, a fin design with 3 fins per inch and a spacing factor of 0.5. It is suitable for use in a wide range of application fields such as computers, medical devices, home appliances and so on.
The specific data is subject to PDF, and the above content is for reference