ATS-06E-20-C3-R0 Allicdata Electronics
Allicdata Part #:

ATS-06E-20-C3-R0-ND

Manufacturer Part#:

ATS-06E-20-C3-R0

Price: $ 4.67
Product Category:

Fans, Thermal Management

Manufacturer: Advanced Thermal Solutions Inc.
Short Description: HEATSINK 54X54X25MM XCUT T412
More Detail: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin...
DataSheet: ATS-06E-20-C3-R0 datasheetATS-06E-20-C3-R0 Datasheet/PDF
Quantity: 1000
10 +: $ 4.19895
30 +: $ 3.96543
50 +: $ 3.73225
100 +: $ 3.49896
250 +: $ 3.26570
500 +: $ 3.03243
1000 +: $ 2.97412
Stock 1000Can Ship Immediately
$ 4.67
Specifications
Series: pushPIN™
Part Status: Active
Type: Top Mount
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Push Pin
Shape: Square, Fins
Length: 2.126" (54.01mm)
Width: 2.126" (54.00mm)
Diameter: --
Height Off Base (Height of Fin): 0.984" (25.00mm)
Power Dissipation @ Temperature Rise: --
Thermal Resistance @ Forced Air Flow: 7.21°C/W @ 100 LFM
Thermal Resistance @ Natural: --
Material: Aluminum
Material Finish: Blue Anodized
Description

Due to market price fluctuations, if you need to purchase or consult the price. You can contact us or emial to us:   sales@allicdata.com

Thermal management is a critical component of any electrical or mechanical system, and more and more systems require efficient cooling solutions to remain operational and reliable. One commonly used solution for dissipating heat is the use of Heat Sinks, and ATS-06E-20-C3-R0 is a perfect example of an effective and efficient Heat Sink.

The ATS-06E-20-C3-R0 Heat Sink is a two-stage aluminum fin Heat Sink that is designed to dissipate maximum heat from high-powered electronic components and modules. Its design consists of two stages: a base plate which is placed in direct contact with the component or module, and a series of finned aluminum heat dissipation wings that increase the surface area available for the transfer of heat away from the component or module.

The ATS-06E-20-C3-R0 Heat Sink is particularly suitable for high-power components such as LEDs, high-power transistors, Power Modules, Microprocessors, and ICs. It is made of aluminum alloy that has high thermal conductivity and good heat dissipation. It is also designed to integrate with various existing mounting systems. The ATS-06E-20-C3-R0 Heat Sink can be designed with various mounting holes, screws, and brackets to fit in different application scenarios.

The heat dissipation process of the ATS-06E-20-C3-R0 Heat Sink can be seen as a transfer of heat from one object to another. Heat from the component or module is directly transferred to the base plate, and then evenly distributed to the finned aluminum wings through convection. The heat then radiates off the fins and is transferred to the surrounding air. This process of heat transfer allows the heat to be dissipated quickly and efficiently, keeping the component or module cool and operational.

The ATS-06E-20-C3-R0 Heat Sink is a cost-effective solution for heat dissipation, as it is easy to install and use. It is highly durable, and its highly efficient heat transfer properties make it the perfect choice for a variety of applications. It is also easy to maintain and is available in a variety of sizes and designs.

The ATS-06E-20-C3-R0 Heat Sink is a reliable, cost-effective, and efficient thermal management solution that is suitable for many different applications. Its two-stage heat dissipation system and aluminum construction make it a reliable choice for most applications, offering efficient heat transfer and long-lasting performance.

The specific data is subject to PDF, and the above content is for reference

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