| Allicdata Part #: | ATS-06E-210-C1-R0-ND |
| Manufacturer Part#: |
ATS-06E-210-C1-R0 |
| Price: | $ 5.32 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 70X70X12MM XCUT |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06E-210-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 4.78863 |
| 30 +: | $ 4.52256 |
| 50 +: | $ 4.25653 |
| 100 +: | $ 3.99055 |
| 250 +: | $ 3.72451 |
| 500 +: | $ 3.45848 |
| 1000 +: | $ 3.39196 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 2.756" (70.00mm) |
| Width: | 2.756" (70.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.472" (12.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 5.17°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Thermal - Heat Sinks
The ATS-06E-210-C1-R0 is an example of a thermal device, also known as a heat sink, used in many electronic applications. Heat sinks are devices consisting of an array of thin fins connected to a metal base. They are used to dissipate heat away from sensitive components of an electronic system by creating a large surface area and convective flow of air over the fins.
Heat sinks work by spreading out the heat produced by the system components over a larger surface area, allowing it to escape more quickly into the airflow. This causes a much lower temperature increase in the components compared to what would happen without the heat sink, which stops components from overheating and failing. The size of the heat sink depends on the rate of energy dissipation that is needed to keep the temperature of the system components within safe levels.
The ATS-06E-210-C1-R0 is a 3-pin aluminum extruded heat sink specifically designed for TO-220 power transistors. It features a 3-pin design, a black anodized finish, a copper heat spreader, and aluminum fins for maximum thermal efficiency. The black anodized finish and the 3-pin design create a rust-proof sink providing superior cooling performance for components. The copper heat spreader keeps the heat away from sensitive areas, and the aluminum fins act as an array for the airflow to pass more quickly over it, increasing the heat dissipation rate.
At the heart of this heat sink’s operation is the principle of thermal conduction. Heat is conducted away from components through the base, and then spreads out through the fins to be dissipated more quickly. The shape and number of the fins are important for enhancing this effect, and both aspects are considered when designing the heat sink. The material selected also plays a role in the thermal conduction process, as metals tend to have higher thermal conductivity than other materials.
The ATS-06E-210-C1-R0 is designed for TO-220 transistors and other small components with power needs up to 30 Amps. It provides superior cooling performance, and is suitable for a range of power electronics applications including, but not limited to, inverters, motor drives, and converters.
The specific data is subject to PDF, and the above content is for reference