ATS-06E-210-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	2.756" (70.00mm)
Width:	2.756" (70.00mm)
Diameter:	--
Height Off Base (Height of Fin):	0.472" (12.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	5.24°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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Introduction
Thermal-heat sinks are one of the most widely used components in electronic devices today. This is due to their ability to dissipate heat away from components that are running higher than their normal operating temperatures. ATS-06E-210-C3-R0 is a series of products manufactured by ATS-Robertson and is specifically designed to meet these needs. In this article, we will discuss the application field and working principle of the ATS-06E-210-C3-R0 thermal-heat sink.

Application Field
The ATS-06E-210-C3-R0 thermal-heat sink is suitable for a wide variety of applications. It can be used in computers, telecommunications, and industrial equipment. It is a low-cost, high-performance solution for controlling temperatures inside any electronic device. The ATS-06E-210-C3-R0 is also used in medical applications, providing cooling for crucial components, such as high-resolution imaging systems, operating theater equipment, and lasers.

Working Principle
The working principle of the ATS-06E-210-C3-R0 thermal-heat sink is based on the principles of thermodynamics. Heat is transferred from the device to the heat sink through conduction. The heat sink uses a passive cooling solution to dissipate the heat. The thermodynamic process works by using the internal fins to absorb the heat from the device and then dissipating it into the surrounding air through convection. The ends of the fins are covered in a special material that boosts this heat-dissipating process.

Design Features
The ATS-06E-210-C3-R0 thermal-heat sink is designed with several features to ensure optimal performance. The internally machined fins are designed to maximize surface contact and increase heat absorption. The design also features a solid aluminum base plate for maximum durability and stability. The design includes an integrated heat-sink clip that ensures to secure the heat sink properly and prevent any air gap that will affect the heat transfer. The unit also comes with integrated fan blades that create air circulation around the fins, further improving convection.

Conclusion
In conclusion, the ATS-06E-210-C3-R0 thermal-heat sink is a reliable and affordable solution for dissipating heat away from electronic components. It is suitable for a range of applications, from medical to industrial. Thanks to its design features, it provides excellent cooling performance with minimal noise output. If you are looking for a reliable and efficient heat-dissipation solution, the ATS-06E-210-C3-R0 is an excellent choice.

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