ATS-06E-36-C2-R0

Thermal - Heat Sinks are designed for cooling and dissipating the heat produced by various devices. The ATS-06E-36-C2-R0 is one of the most popular thermal options available, with its wide range of applications and reliable working principle.

The ATS-06E-36-C2-R0 is a high-end heat sink designed for superior cooling performance, particularly when cooling CPUs and GPUs. Its unique fin structure and highly efficient heatsink base are tailored to meet the demands of high performance computing. The design includes 1.5mm thick copper fins arranged in a staggered geometry, which provide a larger surface area for heat dissipation. Additionally, its low profile design ensures minimal system height.

Due to its unique design, the ATS-06E-36-C2-R0 is ideal for high power to volume applications, where space is at a premium. It is widely used in industrial, energy, medical, military and avionics applications, as well as in many consumer electronic devices. In addition, its low-profile design allows for silent operation as well as low acoustic noise.

The ATS-06E-36-C2-R0’s working principle involves the efficient transfer of heat from the device to the thermal solution via conduction. The heat is then transferred from the thermal solution to the environment, where it is dissipated. This process is known as heat transfer, and is the basis for most thermal solutions. The device’s fin structure and heatsink base ensure maximum heat transfer, while minimizing airflow resistance and acoustic noise.

The ATS-06E-36-C2-R0 is designed for easy and flexible installation, with a variety of mounting options available. Its wide range of applications and reliable working principle make it one of the most popular choices for thermal heat sink solutions. With its superior cooling performance and low profile design, the ATS-06E-36-C2-R0 is an ideal choice for high power to volume applications.