| Allicdata Part #: | ATS-06E-50-C1-R0-ND |
| Manufacturer Part#: |
ATS-06E-50-C1-R0 |
| Price: | $ 3.25 |
| Product Category: | Fans, Thermal Management |
| Manufacturer: | Advanced Thermal Solutions Inc. |
| Short Description: | HEATSINK 30X30X15MM L-TAB |
| More Detail: | Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Alumin... |
| DataSheet: |  ATS-06E-50-C1-R0 Datasheet/PDF |
| Quantity: | 1000 |
| 10 +: | $ 2.94840 |
| 30 +: | $ 2.86860 |
| 50 +: | $ 2.70925 |
| 100 +: | $ 2.54986 |
| 250 +: | $ 2.39047 |
| 500 +: | $ 2.31079 |
| 1000 +: | $ 2.07174 |
| Series: | pushPIN™ |
| Part Status: | Active |
| Type: | Top Mount |
| Package Cooled: | Assorted (BGA, LGA, CPU, ASIC...) |
| Attachment Method: | Push Pin |
| Shape: | Square, Fins |
| Length: | 1.181" (30.00mm) |
| Width: | 1.181" (30.00mm) |
| Diameter: | -- |
| Height Off Base (Height of Fin): | 0.590" (15.00mm) |
| Power Dissipation @ Temperature Rise: | -- |
| Thermal Resistance @ Forced Air Flow: | 18.99°C/W @ 100 LFM |
| Thermal Resistance @ Natural: | -- |
| Material: | Aluminum |
| Material Finish: | Blue Anodized |
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Heat sink is a fundamental component in most of the heat transfer systems. It is an integral part of thermal management solutions used in applications ranging from low power consumer electronics and communications equipment to large-scale industrial systems. ATS-06E-50-C1-R0 is a thermal solution that offers high-efficiency heat transfer performance for those who require high heat dissipation. This thermal solution is especially popular for applications that need to manage system-level thermal cooling, such as laptop computers and wireless communication equipment.
The ATS-06E-50-C1-R0 is a central component in a thermal management system, which is a combination of components such as cooling fans, radiators, cooling fins, heat pipes, and heat sinks. A heat sink is designed to absorb, store, and disperse the heat generated by the electronics within the system. This thermal solution features a one-piece extruded aluminum body that is designed to dissipate heat quickly and evenly. The thermal resistance of the ATS-06E-50-C1-R0 is 0.18°C/W. This thermal performance level provides a satisfactory and reliable thermal management solution for many electronics applications.
The main working principle of the ATS-06E-50-C1-R0 is based on natural convection cooling. Natural convection is a process where air is heated by contact with a higher temperature surface. As the air is heated, it rises through the device, carrying the heat away from the hottest surface. This type of cooling is achieved by maximizing the surface area of the device. The surface of the thermal solution is designed with fins and channels to effectively dissipate heat, and there is also a gap between the base and the fins which allows for more efficient heat dissipation.
The ATS-06E-50-C1-R0 is perfect for electronics applications that require high durability and efficient heat transfer performance. It is widely used in consumer electronics, automotive, communications, and medical applications. It provides a reliable solution for thermal management and can reduce temperature-related system failures in those types of applications. The heat sink is also suitable for use in a variety of industrial applications that require thermal control, such as computers, storage devices, and servers.
In conclusion, the ATS-06E-50-C1-R0 is a popular thermal solution that offers high-efficiency heat transfer performance for those who require reliable thermal control. It is designed with a one-piece extruded aluminum body that maximizes surface area for effective heat dissipation. It is perfect for electronics applications that require a reliable and efficient thermal management solution. This thermal solution is widely used in consumer electronics, automotive, communications, and medical applications.
The specific data is subject to PDF, and the above content is for reference