ATS-06E-59-C3-R0

Series:	pushPIN™
Part Status:	Active
Type:	Top Mount
Package Cooled:	Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method:	Push Pin
Shape:	Square, Fins
Length:	1.378" (35.00mm)
Width:	1.378" (35.00mm)
Diameter:	--
Height Off Base (Height of Fin):	1.181" (30.00mm)
Power Dissipation @ Temperature Rise:	--
Thermal Resistance @ Forced Air Flow:	8.08°C/W @ 100 LFM
Thermal Resistance @ Natural:	--
Material:	Aluminum
Material Finish:	Blue Anodized

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<p>Heat Sinks are an important part of thermal management solutions for electronics. The ATS-06E-59-C3-R0 is a new generation of high-performance thermal management solution with advanced features. It is a heat sink designed for a wide range of applications, including surface mount applications, high-temperature applications, and more.</p><p>The ATS-06E-59-C3-R0 is designed with an advanced aluminum heat transfer plate which allows for highly efficient cooling. It is designed with an easy to install and secure mounting system which makes installation fast and efficient. The design also allows for a wide range of mounting configurations, making it suitable for a variety of applications. The advanced construction also ensures a durable and reliable operation.</p><p>The ATS-06E-59-C3-R0 utilizes thermo-conductive materials which transfer heat to the exterior of the heat sink, providing efficient cooling. Additionally, the design allows for air flow to adequately dissipate heat, while still providing thermal protection. The design is highly efficient, and is able to support temperatures up to 150°C. Also, the design is compact and lightweight, making it ideal for portable or area-specific applications.</p><p>The ATS-06E-59-C3-R0 features a wide range of applications, including surface mount, high-temperature, and industrial uses. For example, the heat sink can be mounted directly onto a surface to dissipate heat at a rapid rate and provide thermal protection. It is also used in industrial applications such as welding, blow molding, and more. The heat sink can also be used for advanced cooling solutions, such as packaging electronics and providing adequate air flow for high-temperature applications.</p><p>The ATS-06E-59-C3-R0 is designed to provide superior thermal performance and reliability. The heat transfer plate is designed to transfer heat and dissipate it quickly, while the mounting system ensures a secure and reliable fit. The design also features advanced air flow channels, which promote effective air circulation, allowing for a highly efficient thermal management solution.</p><p>Overall, the ATS-06E-59-C3-R0 is a reliable and efficient thermal management solution. It is ideal for a wide range of applications, providing superior thermal protection and performance. The advanced design also ensures a secure and reliable fit, making the heat sink suitable for a variety of applications.</p>

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